A transfer device includes: a cassette table; a support unit; a transfer unit; and a control unit as defined herein, the cassette includes a pair of side walls and a support portion as defined herein, and the control unit includes a storage unit configured to store correlation information indicating a correlation as defined herein, and a controller configured to control, based on the correlation information, the direction of the object to be transferred by at least one of the support unit or the transfer unit when the object to be transferred is loaded from the support unit into the cassette such that the amount of deflection of the object to be transferred decreases.

An apparatus includes a drive, a movable arm having a base pivotally connected to the drive, first and second linkages, the first linkage having a first link rotatable on the base at a first rotary joint, a second link connected to the first link at a second rotary joint, and a third link connected to the second link at a third rotary joint, the third link having an end-effector, and the second linkage having a fourth link rotatable on the base at a fourth rotary joint, a fifth link connected to the fourth link at a fifth rotary joint, and a sixth link connected to the fifth link at a sixth rotary joint, the sixth link having another end-effector. The apparatus also includes a master controller coupled to the drive, the master controller being configured to control movements of the movable arm and the base relative to the drive.

A substrate processing system is provided for effective moisture control during fabrication operations. The system includes a buffer chamber with a cooling plate, which is coupled to a cryogenic pump to circulate a cryogen, such as liquid nitrogen. Residual moisture and water vapor released during substrate transfer are captured and condensed onto the cooling plate. A regeneration system monitors moisture accumulation using sensors and initiates regeneration when a set threshold is reached.

The present invention relates to a buffer chamber and a substrate processing apparatus including the buffer chamber. In more detail, the present invention relates to a buffer chamber that can maintain the atmosphere of a buffer unit at low humidity, and a substrate processing apparatus including the buffer chamber. According to an embodiment, the substrate processing apparatus includes: a processing module processing substrates; and an index module transferring substrates to the processing module from a container accommodating substrates, and putting substrates processed at the processing module into the container, wherein the processing module comprises: a transfer chamber having a transfer unit transferring substrates to the processing module; and a buffer chamber that is disposed between the index module and the transfer chamber and in which substrates are temporarily placed, the buffer chamber comprises: a housing providing a standby space; a door opening and closing the housing; a buffer unit in which substrates are placed in the standby space; a gas supply unit supplying gas to the standby space; and an exhaust unit exhausting the standby space, and pressures in the transfer chamber and the index module are different from each other.

A substrate processing method includes providing a substrate to a chamber of a development device, supplying at least a portion of a first developer provided from a first source storage of the development device onto the substrate at a first temperature and performing a development process, supplying a second developer, in which a pressurized CO.sub.2 provided from a second source storage of the development device is dissolved in a portion of the first developer provided from the first source storage, onto the substrate in the chamber at a second temperature lower than the first temperature, wherein the first developer is replaced with the second developer, transporting the substrate from the chamber of the development device to a supercritical drying device, and supplying at least one of a supercritical fluid and a subcritical fluid onto the substrate in the supercritical drying device and drying the second developer.

A substrate is held by an upper holding device, and a lower-surface center region of the substrate is cleaned with use of a lower-surface brush. The substrate is lowered from an upper holding device and transferred to a suction holder of a lower holding device. The substrate held by the suction holder is cleaned with use of a processing liquid. A cup is provided to be liftable and lowerable between an upper cup position and a lower cup position. The cup is in the lower cup position when waiting. A period for the substrate lowering operation and a period for the cup lifting operation at least partially overlap with each other.

In a wafer hand, two carry portions are arranged in line in a first direction, the two carry portions are connected via a joint portion, each of the two carry portions extends from the joint portion in a second direction orthogonal to the first direction, an interval between inner side surfaces of the two carry portions is 170 mm or more, an interval between outer side surfaces of the two carry portions is 280 mm or less, and when a distance between inner side surfaces of the two carry portions is A (mm), and a length of the inner side surfaces of the two carry portions in the second direction is L (mm), a relationship of L(300.sup.2A.sup.2).sup.0.5 is satisfied.

An exemplary embodiment of the present invention provides a substrate treating method and a substrate treating apparatus that are capable of preventing contamination of a subsequent substrate. According to the exemplary embodiment, when the pressure monitoring operation of the transfer chamber, the method may include acquiring a graph representing the pressure change in the transfer chamber over time, and determining whether there is a pressure abnormality inside the transfer chamber based on a shape of the graph.

A method of adjusting a substrate transfer position is provided in a substrate processing system including: a batch processing section; a single-substrate processing section; and a substrate standby section configured to cause a substrate to be transferred from the batch processing section to the single-substrate processing section to wait. The substrate standby section includes: a delivery table; and a first transfer robot including a first holding section. The single-substrate processing section includes a second transfer robot including a second holding section. The method includes: acquiring, by the second holding section, the substrate from the delivery table; detecting a shift amount of the substrate with respect to a reference position while the second holding section holds the substrate acquired from the delivery table; and correcting a horizontal position when the first holding section mounts the substrate on the delivery table, based on the detected shift amount.

A sensor module includes a body including a first body part and a second body part detachably coupled to the first body part, a first sensor unit on a lower surface of the body, and configured to detect a contact area in which the lower surface of the body contacts a first external object and to output a first measurement value, a second sensor unit on a side surface of the body and configured to output a second measurement value by measuring a distance between the side surface of the body and a second external object, and a control circuit in the body part configured to control the first sensor unit and the second sensor unit and generate measurement data based on the first measurement value and the second measurement value. The first sensor unit and the second sensor unit are in the second body part.