A processing apparatus includes a pick configured to hold and transfer a substrate, a first suction pad disposed at a position in the pick where the first suction pad comes into contact with a concavely curved substrate, a second suction pad disposed at a position in the pick where the second suction pad comes into contact with a convexly curved substrate, a pressure sensor configured to detect a pressure in a first suction path connected to the first suction pad and a pressure in a second suction path connected to the second suction pad, and a controller configured to control suction operations by the first suction pad and the second suction pad based on a detection value of the pressure sensor.

A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

An apparatus for transferring light-emitting diodes (LEDs) includes a backing board for supporting a backplane, a sealing member formed on the backing board around a periphery of the backplane, a transparent panel formed on the sealing member such that a space is formed between the backing board and the transparent panel, and a vacuum source for drawing a vacuum on the space.

An apparatus for transferring light-emitting diodes (LEDs) includes a backing board for supporting a backplane, a sealing member formed on the backing board around a periphery of the backplane, a transparent panel formed on the sealing member such that a space is formed between the backing board and the transparent panel, and a vacuum source for drawing a vacuum on the space.

A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

A transferring module includes a support plate on which a substrate is supported, and an adsorption portion disposed on the support plate, adsorbing and fixing a lower surface of the substrate, and including a groove formed inwardly concavely in one direction in an outer peripheral surface.

A substrate transport apparatus including a frame, a substrate transport arm connected to the frame, the substrate transport arm having an end effector, and a drive section having at least one motor coupled to the substrate transport arm, wherein the at least one motor defines a kinematic portion of the drive section configured to effect kinematic motion of the substrate transport arm, and the drive section includes an accessory portion adjacent the kinematic portion, wherein the accessory portion has another motor, different and distinct from the at least one motor, the another motor of the accessory portion is operably coupled to and configured to drive one or more accessory device independent of the kinematic motion of the substrate transport arm.

The invention relates to a substrate holder device at least including at least one control valve and at least one substrate holder with a substrate holder surface and a substrate holder rear side. Furthermore, the invention relates to bonding device and a method for bonding.

The invention relates to a substrate holder device at least including at least one control valve and at least one substrate holder with a substrate holder surface and a substrate holder rear side. Furthermore, the invention relates to bonding device and a method for bonding.