A substrate transfer module, which provides clean environment to prevent particles from moving to a substrate, and semiconductor manufacturing equipment including the same. The substrate transfer module of the semiconductor manufacturing equipment includes a transfer chamber providing a transfer space of the substrate, having a chamber groove lowered by a predetermined height from a bottom surface to form a gap with respect to the bottom surface, a guide member provided in an inside portion of the transfer chamber, and a substrate transfer robot configured to move along the guide member and to transfer the substrate.

A substrate loading apparatus includes a housing that provides a space where a substrate is configured to be disposed, a transfer track in the housing on an upper side of the housing, and a particle removal device connected to the transfer track. The particle removal device includes a nozzle configured to inject a gas and a module housing that has an intake hole. When viewed in plan, the intake hole surrounds the nozzle.

A rotor assembly includes a rotor disposable around a central member, connectable with a holder and having upper and lower axial ends. A stator assembly includes a housing having a central bore, the rotor and central member being disposed within the bore, and electromagnetic coil assemblies disposed within the housing, spaced around the axis and configured to exert magnetic torque on the rotor such that the rotor angularly displaces about the central axis. One or more actuators are configured to linearly displace the stator assembly and the rotor along the central axis relative to the central member. A sensor assembly is connected with the stator housing and includes an axial position sensor spaced axially from the lower axial end of the rotor and configured to sense the position of the rotor along the central axis, the axial position sensor being displaceable axially when the actuator displaces the stator housing.

There is provided a technique that includes: a boat including plural slots to hold at least one substrate; a process furnace that processes the at least one substrate held in the boat; a boat elevator that raises and lowers the boat; a transfer device that transfers the at least one substrate between plural carriers where the at least one substrate is stored and the boat; and a controller capable of controlling the boat elevator and the transfer device, wherein the controller sets plural positions where the transfer device transfers the at least one substrate to the boat elevator, and select the positions to minimize a number of shifts among the positions of the boat elevator or total time taken during the shifts.

The present invention relates to an apparatus for processing supercritical substrate comprising: a chamber having a processing space; a substrate supporting unit for supporting a substrate; an opening/closing unit for opening or closing the processing space; a loading/unloading unit for loading a substrate into or unloading the substrate from the substrate supporting unit; a detection unit for detecting the loading/unloading unit or the substrate; and a control unit for controlling the opening/closing unit, wherein the control unit controls the operation of the opening/closing unit in response to the detection unit detecting the loading/unloading unit or the substrate.

A mapping device capable of detecting a stored state of a square shaped plate-form object including: a first detection part having a first detection axis which crosses a first side and a second side perpendicular to the first side object to detect a first corner thickness; a second detection part having a second detection axis which crosses the first and third sides of the object to detect a second corner thickness; a first information acquiring unit acquiring a first information relating to a warpage amount in the first direction of the object; an adjustment calculation unit calculating an adjusted detection value relating to the thickness of the object in the first direction by adjusting, based on the first information, a sum of the first and second corner thicknesses or an average thereof; and a distinguishing unit distinguishing the stored state of the object using the adjusted detection value.

A substrate treating apparatus and a substrate transporting method wherein a platform is disposed on a first ID block, and a platform is placed on a second ID block. A currently-used carrier platform is provided only on the first ID block. Accordingly, a substrate is transported in both a forward path and a return path between the first ID block and a second treating block. The substrate is returned not to the first ID block but to the second ID block disposed between the two treating blocks in the return path.

A substrate processing apparatus includes a first chamber, a substrate loader under a first pressure and including a load port configured to load a substrate, a processing chamber inside the first chamber and including a processing bath in which a processing liquid for processing the substrate is provided and a bath cover configured to cover the processing bath, a processing liquid supplier configured to supply the processing liquid to the processing chamber, a first gas supply device configured to cause an internal pressure of the first chamber to be at a second pressure higher than the first pressure by supplying gas into the first chamber, and a second gas supply device configured to cause an internal pressure of the processing chamber to be at a third pressure higher than the first pressure by supplying gas into the processing chamber.

An apparatus transfers a substrate. The apparatus includes: one substrate holder adsorbing and holding the substrate via an adsorption port; a nozzle being provided on a surface of the one substrate holder and allowing gas to pass therethrough; an adsorption flow path being connected to the adsorption port and allowing gas to flow therethrough; and a nozzle flow path being connected to the nozzle and allowing the gas to flow therethrough. The adsorption flow path of at least one of the one substrate holder and another substrate holder and the nozzle flow path are connected to a common gas suction mechanism. A pressure sensor and flow rate sensor are provided for the nozzle flow path. The flow rate of the nozzle flow path is varied according to a distance between an interferer and the one substrate holder and the pressure of the nozzle flow path.

A working system for a semiconductor packaging process includes a machine equipment, a supply unit and a return device. The supply unit is correspondingly connected to the machine equipment and includes an input device and an output device. The return device is connected to the input device and the output device. As such, a magazine is transferred from the input device to the output device via the return device, thereby accelerating the operation speed of a production line.