The present invention provides a measuring apparatus for measuring a wafer carrier having an opening end and at least one gas tower deposited inside, the measuring apparatus comprising a carrying interface for securing the wafer carrier. The opening end of the wafer carrier faces an inspection space of measuring apparatus. The carrying interface having a gas supplying assembly connected to a base of the wafer carrier so as to supply gas to the wafer carrier. The internal of the inspection space disposed a measuring assembly which is mainly used to measure gas flow rate from the gas tower in the accommodating space. The measuring assembly comprises a plurality of wind speed sensing elements and a plurality of displacement sensing element, which are fitted to the a second connecting element.

Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.

There is provided a technique that includes: a close contact structure having an opening and capable of contacting a purge port of a substrate container; a bushing connected to a surface of the close contact structure opposite to its surface contacting the purge port, and provided with a cylinder communicating with the opening; a gas pipe clearance-fitted with an inner periphery of the cylinder along a first gap; a port flange fixedly connected to the gas pipe and provided with a surface perpendicular to an axis of the gas pipe; and an elastic structure between the port flange and the bushing to bias the bushing away from the port flange including a hole concentric with the gas pipe, a diameter of the hole corresponds to an outer diameter of the cylinder, and an outer periphery of the cylinder is clearance-fitted with the hole along a second gap.

A substrate container includes a shell defining an interior space and a manifold with an inlet and a gas distributing surface. The shell includes a front opening, a bottom wall, and a rear wall. The manifold is attached to the bottom wall and is closer to the front opening than the rear wall. The gas distributing surface is configured to distribute purge gas into the interior space. A method of purging an open substrate container includes supplying a first stream of purge gas to a manifold and supplying a second stream of purge gas to an interior space of the substrate container. The method also including the manifold distributing the purge gas of the first stream within the interior space of the substrate container.

A frame cassette may be provided, which comprises a frame holder holding a vertical stack of substrates, a gas distribution manifold comprising an inlet port and rows of distribution orifices arranged along a vertical direction, and a gas exhaust manifold comprising an outlet port and rows of exhaust orifices arranged along the vertical direction and configured to collect the purge gas. Values of the pneumatic conductance for the rows of distribution orifices increase with a length of a gas flow path within the gas distribution manifold from the inlet port to a respective row of distribution orifices. A lateral flow of the purge gas may be induced between the inlet port and the outlet port by pressuring the inlet port relative to the outlet port while applying a stream of the purge gas to the inlet port.

A linearly moving mechanism includes an internal moving body provided within a case body and configured to be moved in a linear direction, the internal moving body being configured to move an external moving body connected to a connection member protruded from the case body through an opening formed at the case body; a seal belt extending in the linear direction and provided within the case body to close the opening, a first surface side of both end portions of the seal belt in a widthwise direction thereof facing an edge portion of the opening while being spaced apart therefrom; and a deformation suppressing member provided to face a second surface side of the both end portions to suppress deformation of the seal belt, the seal belt being connected to the internal moving body to be moved along with a movement of the internal moving body.

The rear retainer comprises: a rear-side substrate support portion which is disposed to be paired with the lid-side substrate support portion in the substrate housing space and is capable of supporting the edges of substrates, and which, when the container body opening portion is closed by the lid, cooperates with the lid-side substrate support portion to support the substrates with the edges of the substrates arranged in parallel; a protruding wall portion with an outer surface protruding toward the container body opening portion and an inner surface recessed toward the container body opening portion, the protruding wall portion having the rear-side substrate support portion provided on the protruding side of the protruding wall portion; and a circulation hole which, when the protruding side of the protruding wall portion is facing downward, allows circulation of a liquid and/or a gas that is positioned on the inner surface side of the protruding wall portion.

Proposed are article storage equipment in a semiconductor fabrication facility, the article storage equipment being capable of power supply with a more simplified configuration, and a logistics system of a semiconductor fabrication facility including the same. Article storage equipment in a semiconductor fabrication facility according to one aspect includes a storage unit installed around a rail that provides a travel route of a transport vehicle and configured to store a transport container in which a wafer is accommodated, a purge unit configured to supply an inert gas into the transport container, a control unit configured to identify the transport container stored in the storage unit and control the purge unit to supply the inert gas into the transport container, and a power supply unit configured to supply a current induced from a power supply cable installed along the rail to the control unit.

A wafer transfer device detection system includes detectors, a filling device, a wafer transfer device and a control center. Detectors are disposed between a plurality of process equipment in a process. Filling device performs a filling procedure. Wafer transfer device includes body and sensor disposed in body. Wafer transfer device transmits wafer of process. Sensor detects a gas concentration inside wafer transfer device during a transportation stage of the process. If gas concentration is higher than a preset gas concentration, sensor generates a wireless communication signal. Control center is coupled to detectors and filling device. If detectors receive the wireless communication signal. Detectors notify control center so that the control center transmits wafer transfer device to filling device from process. Control center controls the filling device to perform filling procedure so as to adjust gas concentration to a target gas concentration to retransmit wafer transfer device back to process.

A semiconductor workpiece transport pod includes: a lower container, having a top opening; an upper cover, having at least one lateral surrounding groove; and at least one airtight strip, having a base and at least one skirt, the base accommodated in the lateral surrounding groove, the skirt connected to the base and extending outward. When the upper cover is joined with the top opening of the lower container, the skirt of the airtight strip is elastically bent and presses tightly against an inner sidewall of the lower container to form airtightness.