The present invention provides a measuring apparatus for measuring a wafer carrier having an opening end and at least one gas tower deposited inside, the measuring apparatus comprising a carrying interface for securing the wafer carrier. The opening end of the wafer carrier faces an inspection space of measuring apparatus. The carrying interface having a gas supplying assembly connected to a base of the wafer carrier so as to supply gas to the wafer carrier. The internal of the inspection space disposed a measuring assembly which is mainly used to measure gas flow rate from the gas tower in the accommodating space. The measuring assembly comprises a plurality of wind speed sensing elements and a plurality of displacement sensing element, which are fitted to the a second connecting element.

Described are methods and apparatuses that are useful for removing contaminants from substrate containers that are used to hold, store, or transport semiconductor substrates.

Apparatuses including substrate container attachment interfaces and substrate container adapters are provided. The substrate container attachment interfaces and substrate container adapters include at least one engagement feature configured to engage with a projection or recess provided in a substrate container. Adapters can include a cassette configured to be attached to, or integrally formed including the substrate container attachment interfaces. The substrate container attachment interfaces can attach to side columns provided in substrate containers. The substrate container attachment interfaces can include or be joined to environmental adjustment packs and/or sensors. The adapters can be configured to be at predetermined heights, and the predetermined heights can be selected based on interactions with automated handling.

A measurement station for measuring particle contamination in a transport enclosure for the atmospheric transport and storage of semiconductor wafers includes a particle counter and an interface designed to be coupled to the shell of a transport enclosure in place of the door. The interface includes a sampling orifice fluidly connected to the particle counter. The measurement station also includes a clean-gas injection device having at least one injection line including at least one injection nozzle to be fluidly connected to a ventilation port of the transport enclosure coupled to the interface for injecting clean gas into the transport enclosure, from outside the transport enclosure, through the at least one ventilation port of the transport enclosure.

Apparatus and techniques are described herein for use in manufacturing electronic devices, such as can include organic light emitting diode (OLED) devices. Such apparatus and techniques can include using one or more modules having a controlled environment. For example, a substrate can be received from a printing system located in a first processing environment, and the substrate can be provided a second processing environment, such as to an enclosed thermal treatment module comprising a controlled second processing environment. The second processing environment can include a purified gas environment having a different composition than the first processing environment.

A filter module includes an interface body and a filter retention body. A filter can be disposed between the filter retention body and a filter retainer joined to the filter retention body. The filter retention body can further include a valve. The filter retainer can be joined to the filter retention body by a snap fit, a press-fit, or a weld. The filter retainer can include stand-offs configured to contact the filter such that the filter is held away from the filter grill. The filter module can be used for providing purge in a wafer container such as a front opening unified pod (FOUP).

An EFEM is provided with a circulation path including a substrate transfer space formed inside a housing and a return path configured to return gas flowing from one side to the other side of the substrate transfer space, the EFEM including: a partition wall configured to separate the substrate transfer space and the return path; a capture part provided in the return path having a higher pressure than the substrate transfer space in a state in which the gas circulates through the circulation path, and configured to capture particles contained in the gas flowing through the return path; and a connecting pipe configured to guide the gas flowing inside a predetermined device arranged in the substrate transfer space to the return path, wherein the connecting pipe is connected to the return path on an upstream side of the capture part in a gas flow direction.