The overhead transport vehicle includes: a winding drum configured to lift and lower a lifting part by winding and paying out a plurality of suspending members; at least one guide roller around which the suspending members paid out from the winding drum are wound; a body part supporting the winding drum and the guide roller; at least one position adjusting part configured to move a portion of each suspending member connected to the lifting part in a lifting direction by moving a relative position of the guide roller with respect to the body part; and a control part configured to control movement of the guide roller by the position adjusting part, based on information on an inclination of the lifting part.

Provided are an alignment jig, a side track buffer system including the same, and an alignment method using the same. The alignment jig includes a horizontal jig fixed to a bottom plate of a side track buffer to extend in a horizontal direction to a lower portion of the transfer rail, and a vertical jig fixed to the transfer rail to extend downward in a vertical direction so as to be adjacent to a top surface in the horizontal direction. A separation distance between an intersection point of the vertical jig and the horizontal jig and a central portion of the bottom plate is detected as a buffer separation distance, and a buffer frame is horizontally moved automatically or manually to allow the buffer separation distance to match a reference separation distance, so that the side track buffer is installed in an accurate position.

A first container includes a pair of first held sections serving as a pair of held sections, and a second container includes a pair of second held sections serving as a pair of held sections. A first distance between the two first held sections is smaller than a second distance between the two second held sections. A first detector is configured to detect a detection target section in the first held sections and not detect the detection target section in the second held sections while a holder device is disposed at a holding reference position. A second detector is configured to detect a detection target section in the second held sections and not detect the detection target section in the first held sections while the holder device is disposed at the holding reference position.

A rotor assembly includes a rotor disposable around a central member, connectable with a holder and having upper and lower axial ends. A stator assembly includes a housing having a central bore, the rotor and central member being disposed within the bore, and electromagnetic coil assemblies disposed within the housing, spaced around the axis and configured to exert magnetic torque on the rotor such that the rotor angularly displaces about the central axis. One or more actuators are configured to linearly displace the stator assembly and the rotor along the central axis relative to the central member. A sensor assembly is connected with the stator housing and includes an axial position sensor spaced axially from the lower axial end of the rotor and configured to sense the position of the rotor along the central axis, the axial position sensor being displaceable axially when the actuator displaces the stator housing.

A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.

A wafer handling device is configured to transport a wafer tray. The wafer handling device includes a sucker module and a transporting apparatus. The sucker module includes a sucker body, at least one airtight assembly, and a pump. The sucker body includes a first portion and a second portion. The first portion has a hole and a first air sucking hole. The second portion has a second air sucking hole. The airtight assembly is connected to the hole. The pump has a suction tube connected to the first air sucking hole and the second air sucking hole. The transporting apparatus is configured to move the sucker body. When the sucker body is connected to the wafer tray, the first portion, the second portion, and the wafer tray form an airtight space.

A method includes establishing, by a diagnostic disc, a secure wireless connection with a computing system using a wireless communication circuit of the diagnostic disc before or after the diagnostic disc is placed into a processing chamber. The method further includes generating, by at least one non-contact sensor of the diagnostic disc, sensor data of a component disposed within the processing chamber. The method further includes storing the sensor data in a memory of the diagnostic disc. The method further includes wirelessly transmitting the sensor data to the computing system, using the wireless communication circuit. The method further includes terminating the secure wireless connection with the computing system and clearing the sensor data from the memory of the diagnostic disc.

An apparatus for producing a semiconductor device comprises a stage, a bonding head, a bonding tool and a first camera that are attached to the bonding head, and a controller, the apparatus moreover being such that the controller is configured to execute for each of one or more points: a process of mounting an inspection chip on a mounting surface; a process of acquiring, as an inspection image, an image of the mounting surface after the inspection chip has been mounted thereon captured by the first camera; a process of calculating, as an area correction amount C, a correction amount for a camera offset amount Ocm on the basis of the position of the inspection chip in the inspection image; and a process of associating the calculated area correction amount C and the position of a discretionary point and then storing the associated information in a storage device.

The present invention relates to an apparatus for processing supercritical substrate comprising: a chamber having a processing space; a substrate supporting unit for supporting a substrate; an opening/closing unit for opening or closing the processing space; a loading/unloading unit for loading a substrate into or unloading the substrate from the substrate supporting unit; a detection unit for detecting the loading/unloading unit or the substrate; and a control unit for controlling the opening/closing unit, wherein the control unit controls the operation of the opening/closing unit in response to the detection unit detecting the loading/unloading unit or the substrate.

A method for calibration including determining a temperature induced offset in a pedestal of a process module under a temperature condition for a process. The method includes delivering a wafer to the pedestal of the process module by a robot, and detecting an entry offset. The method includes rotating the wafer over the pedestal by an angle. The method includes removing the wafer from the pedestal by the robot and measuring an exit offset. The method includes determining a magnitude and direction of the temperature induced offset using the entry offset and exit offset.