A substrate processing apparatus may include a substrate support unit in a lower portion of a process chamber; an edge ring on and along an edge of an upper surface of the substrate support unit and protruding from the upper surface of the substrate support unit; and a substrate alignment sensor on the substrate support unit. The substrate alignment sensor may include a body, an imaging unit, and a control unit. The imaging unit may be on a bottom surface of the body and configured to image a sidewall of the edge ring and a sidewall of the body. The control unit may be configured to control the imaging unit and calculate a spacing between the sidewall of the edge ring and the sidewall of the body. The control unit may be configured to align the substrate alignment sensor with the substrate support unit based on the spacing.

Provided is a substrate-holding device capable of improving the in-plane uniformity of a wafer back surface pressure and the flatness of wafer holding, flattening not only a flat wafer but also a warped wafer, and holding a wafer in a back surface non-contact manner, and an optical inspection device including the substrate-holding device. The substrate-holding device includes a wafer chuck 102 (rotary chuck) and a clamp unit 103 that supports an edge of a substrate 101 to be rotated by the wafer chuck 102 (rotary chuck) in a radial direction and a circumferential direction of the substrate 101, in which the wafer chuck 102 is provided with a plurality of static pressure bearing pads that hold the substrate 101 in a back surface non-contact manner, the plurality of static pressure bearing pads including a plurality of gas supply ports 111 that supplies gas to the substrate 101.

In a mounting apparatus, a head part supports: a first imaging unit and a second imaging unit each including an optical system and an imaging element disposed to satisfy a Scheimpflug condition such that a plane parallel to a reference plane becomes a focal plane; and a mounting tool performing a mounting work. The mounting apparatus includes a detection part detecting an inclination of a stage surface or a work plane with respect to the reference plane using height information of each of multiple spots calculated based on a first top-view image and a second top-view image obtained by displacing the head part with respect to a stage and causing the first imaging unit and the second imaging unit to respectively capture and output images of the multiple spots of the stage surface or the work plane serving as a target of the mounting processing.

A method of adjusting a substrate transfer position is provided in a substrate processing system including: a batch processing section; a single-substrate processing section; and a substrate standby section configured to cause a substrate to be transferred from the batch processing section to the single-substrate processing section to wait. The substrate standby section includes: a delivery table; and a first transfer robot including a first holding section. The single-substrate processing section includes a second transfer robot including a second holding section. The method includes: acquiring, by the second holding section, the substrate from the delivery table; detecting a shift amount of the substrate with respect to a reference position while the second holding section holds the substrate acquired from the delivery table; and correcting a horizontal position when the first holding section mounts the substrate on the delivery table, based on the detected shift amount.

A method for operating a substrate transferring device that includes a substrate container holding at least two substrates stacked vertically, a hand having two fingers, a manipulator, and a controller. A mapping device detects a vertical position of a higher substrate, and a substrate detector measures a distance to a principal surface of the substrate. The controller moves the hand to a position below the detected vertical position and then advances the hand to pick up the higher substrate. During forward movement, the substrate detector acquires at least three consecutive, linearly aligned distance measurements along a front-and-rear direction. Based on a relationship among the measurements, the controller determines whether the principal surface of the higher substrate is warped. If warpage is detected, the controller predicts a possibility of collision between the hand and the substrate and withdraws the hand to avoid collision.