A die substrate, including a dielectric body, the body having a first body surface, a second body surface on an opposite side and body edge surfaces located in between. Current-carrying metal lines located in the dielectric body. One or more of the metal lines routed to one or more of the body edge surfaces. A termination layer located on the at least one body edge surface and electrically connected to the least one of the metal lines routed to the body edge surfaces. Electrically conductive plating located on the at least one body edge surface. The plating connected to the termination layer for an electrical current connection or a ground connection to the at least one metal line. A method of manufacturing an integrated circuit package, the package and a computer having the die substrate are also disclosed.

A semiconductor package includes a semiconductor element, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer. The first insulating layer covers the semiconductor element. The first wiring layer includes a first layer section. The first layer section covers the first insulating layer. The second insulating layer covers the first insulating layer and the first wiring layer. The second wiring layer is electrically connected to the semiconductor element through a second through hole and a third through hole. The second wiring layer includes a second layer section. The second layer section covers the second insulating layer. The second layer section of the second wiring layer has a portion overlying the first layer section of the first wiring layer with the second insulating layer interposed.

The present disclosure provides a wiring substrate and an electronic apparatus. The wiring substrate includes a substrate and a shielding signal line disposed on the substrate. The substrate includes a functional region; the functional region is provided with a plurality of pad groups; the plurality of pad groups are distributed in an array along a first direction and a second direction respectively, and the second direction intersects with the first direction. The shielding signal line includes a first portion surrounding all pad groups and second portions connected with the first portion, and the second portions are located between two adjacent pad groups along the second direction. The electronic apparatus includes the wiring substrate and an electronic element connected with the pad groups.

A chip package structure includes an assembly containing an interposer and semiconductor dies; a packaging substrate attached to the assembly through solder material portions; and a lid structure attached to the packaging substrate. The lid structure includes: a first plate portion having a first thickness and located in an interposer-projection region having an areal overlap with the interposer in a plan view; a second plate portion having a second thickness that is less than the first thickness, laterally surrounding, and adjoined to, the first plate portion, and located outside the interposer-projection region; and a plurality of foot portions adjoined to the second plate portion, laterally spaced from the first plate portion, and attached to a respective top surface segment of the packaging substrate through a respective adhesive portion.

A substrate includes: a first printed circuit board layer including a first insulating layer and a first wiring layer, disposed on a lower surface of the first insulating layer; a second wiring layer, disposed on an upper surface of the first insulating layer; a bridge disposed above the first printed circuit board layer and including circuit wirings; a first bridge insulating layer and a second bridge insulating layer, disposed in the bridge and on which the circuit wirings are disposed, respectively; and a second printed circuit board layer including a second insulating layer surrounding side surfaces of the bridge and covering the first insulating layer and the second wiring layer. A first stacking direction in which the first insulating layer and the second insulating layer are stacked and a second stacking direction in which the first bridge insulating layer and the second bridge insulating layer are stacked are different.

A substrate includes: a first printed circuit board layer including a first insulating layer and a first wiring layer, disposed on a lower surface of the first insulating layer; a second wiring layer, disposed on an upper surface of the first insulating layer; a bridge disposed above the first printed circuit board layer and including circuit wirings; a first bridge insulating layer and a second bridge insulating layer, disposed in the bridge and on which the circuit wirings are disposed, respectively; and a second printed circuit board layer including a second insulating layer surrounding side surfaces of the bridge and covering the first insulating layer and the second wiring layer. A first stacking direction in which the first insulating layer and the second insulating layer are stacked and a second stacking direction in which the first bridge insulating layer and the second bridge insulating layer are stacked are different.

A package structure is provided. The package structure includes a chip structure having opposite surfaces with different widths. The chip structure has an inclined sidewall between the opposite surfaces. The package structure also includes a protective layer laterally surrounding the chip structure.

A semiconductor device has a first semiconductor package, second semiconductor package, and RDL. The first semiconductor package is disposed over a first surface of the RDL and the second semiconductor package is disposed over a second surface of the RDL opposite the first surface of the RDL. A carrier is initially disposed over the second surface of the RDL and removed after disposing the first semiconductor package over the first surface of the RDL. The first semiconductor package has a substrate, plurality of conductive pillars formed over the substrate, electrical component disposed over the substrate, and encapsulant deposited around the conductive pillars and electrical component. A shielding frame can be disposed around the electrical component. An antenna can be disposed over the first semiconductor package. A portion of the encapsulant is removed to planarize a surface of the encapsulant and expose the conductive pillars.

An electronic device package and method of fabricating such a package includes a first and second components encapsulated in a volume of molding material. A surface of the first component is bonded to a surface of the second component. Upper and lower sets of redistribution lowers that include, respectively, first and second sets of conductive interconnects are formed on opposite sides of the molding material. A through-package interconnect passes through the volume of molding material and has ends that terminate, respectively, within the upper set of redistribution layers and within the lower set of redistribution layers.

A semiconductor structure includes an interposer including redistribution wiring interconnects and redistribution insulating layers; a first semiconductor die attached to the interposer through a first array of solder material portions; and a second semiconductor die attached to the interposer through a second array of solder material portions. The interposer includes at least one inductor structure located between an area of the first array of solder material portions and an area of the second array of solder material portions in a plan view and laterally encloses a respective area in the plan view.