An exemplary method includes at a bonding temperature, bonding a semiconductor chip to an organic laminate substrate using solder; without cooldown from the bonding temperature to room temperature, at an underfill dispense temperature, dispensing underfill between the semiconductor chip and the organic laminate substrate; and curing the underfill within a range of temperatures above the underfill dispense temperature. Another exemplary method includes depositing a first solder on pads of an organic laminate substrate; contacting a second solder on pillars of a semiconductor chip to the first solder on the pads of the organic laminate substrate; and solder bonding the semiconductor chip to the organic laminate substrate.

A method of manufacturing an electronic device includes: providing a vapor generating chamber that accommodates a heat transfer fluid; providing a substrate stage within the vapor generating chamber, the substrate stage including a seating surface and suction passages penetrating the substrate stage to be open to the seating surface; loading a substrate on the substrate stage, wherein electronic components are disposed on the substrate via bumps; generating at least a partial vacuum in the suction holes to suction-support the substrate on the seating surface; heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber; and soldering the bumps using the saturated vapor.

A method for debonding a wafer from a bonded wafer stack is disclosed. Initially, a light-absorbing layer is placed on a carrier. A wafer is then attached to the light-absorbing layer of the carrier via an adhesive layer to form a bonded wafer stack. After processing the wafer has been processed, a light pulse from a flashlamp is applied to a non-wafer side of the carrier to heat the light-absorbing layer and the adhesive layer in order to loosen the wafer from the bonded wafer stack. Finally, the wafer is removed from the bonded wafer stack.

A collet for die attaching includes a first portion, a second portion and a third portion. The first portion includes a plate portion including a first through hole extending therethrough and having first and second surfaces opposite to each other in a vertical direction, and a protrusion portion on the second surface of the plate portion and protruding downwardly in the vertical direction. The second portion is under the first portion, and has first and second surfaces opposite to each other in the vertical direction and includes a second through hole extending therethrough and overlapping the protrusion portion of the first portion in the vertical direction. The third portion is between the first and second portions, and contacts the second surface of the plate portion and the first surface of the second portion.

A bond head assembly includes a collet and a planar compliant locating structure having a plane. The collet is operative to hold a die during a bonding process. The planar compliant locating structure includes a first flexural element that is positioned to contact a first side surface of the collet and a second flexural element that is positioned to contact a second side surface of the collet. The first and second side surfaces of the collet are substantially orthogonal to each other. Each of the first and second flexural elements is arranged such that a portion thereof is deflectable by movement of the collet against the flexural element, thereby causing the first or second flexural element to exert a biasing force against the first or second side surface of the collet along the plane of the compliant locating structure to restrict positional shifts of the collet towards the flexural element.

A die placement system provides a tip body and die placement head to ensure planarity of a die to substrate without the need for calibration prior to each pick and place operation. A self-aligning tip incorporated into a tip body aids in die placement/attachment. This tip provides for global correction of planarity errors that exist between a die and substrate, regardless of whether those errors stem from gantry (i.e. die-side misalignment) or machine deck tool (i.e. substrate-side misalignment) misalignment.

A bonding and indexing method is provided, having a first index head to move a substrate in an indexing direction from a first position to a second position; a second index head to move the substrate in an indexing direction from the second position to a third position; and the first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.

A method for debonding a wafer from a bonded wafer stack is disclosed. Initially, a light-absorbing layer is placed on a carrier. A wafer is then attached to the light-absorbing layer of the carrier via an adhesive layer to form a bonded wafer stack. After processing the wafer has been processed, a light pulse from a flashlamp is applied to a non-wafer side of the carrier to heat the light-absorbing layer and the adhesive layer in order to loosen the wafer from the bonded wafer stack. Finally, the wafer is removed from the bonded wafer stack.

An underfill dispensing system includes a substrate table configured to support a substrate including a plurality of bonding areas for mounting a plurality of semiconductor chips, a heating structure disposed on an upper surface of the substrate table and including a plurality of heating blocks, a dispensing head configured to dispense underfill to a plurality of bonding areas of the substrate, above the substrate table, an imaging device, and a control unit configured to control the heating structure and the dispensing head. The imaging device is configured to image at least one of the substrate and the plurality of semiconductor chips to generate an image. The controller is configured to control the plurality of heating blocks independently of one another based on the image.

A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.