A wire bonding apparatus may include a wire supply portion configured to supply a conductive wire, a capillary configured to draw out the conductive wire supplied from the wire supply portion, and a wire holder disposed between the capillary and the wire supply portion. The wire holder has a first clamp and a second clamp that are spaced apart from each other and are configured to clamp the conductive wire. Each of the first clamp and the second clamp has a polygonal column shaped support body having with a plurality of contact surfaces along a circumference of each of the first clamp and the second clamp, and the polygonal column shaped support body is configured to rotate in a circumferential direction about a central axis of the polygonal column shaped support body.

The present invention relates to a laser compression bonding process which adsorbs a semiconductor chip (C) with a bonding tool (10) to apply a flux to a bump on the bottom surface of the semiconductor chip (C) in order to minimize the occurrence of problems such as flux application defect, alignment failure, bonding failure, etc. by unfolding the semiconductor chip transformed by preheating with a laser as flat as possible in a process of flux dipping or position alignment or bonding by picking up the semiconductor chip with an adsorption type bonding tool in a laser compression bonding process, and which bonds the semiconductor chip (C) to a substrate (P) by irradiating a laser beam (L) from a laser generator (20) installed in the upper part of the bonding tool (10) while placing and pressing the semiconductor chip on the substrate P after aligning the position with the substrate (P), wherein the laser generator (20) preheats the semiconductor chip (10) at a predetermined temperature in order to restore the semiconductor chip (10) to an original flat state while the bonding tool (10) adsorbs the semiconductor chip (C).

A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.

Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.

A solder reflow system may include a solder reflow apparatus, a condensation apparatus and a cleaning apparatus. The solder reflow apparatus may be configured to reflow a solder of a semiconductor package using a heat transfer fluid. The condensation apparatus may be configured to receive the semiconductor package processed by the solder reflow apparatus. The condensation apparatus may condensate a gas generated from the heat transfer fluid to convert the gas into a liquid. The cleaning apparatus may be configured to clean the semiconductor package processed by the condensation apparatus using a cleaning agent. Thus, the heat transfer fluid stained with the semiconductor package may be removed by the condensation apparatus so that the heat transfer fluid may not be introduced into the cleaning apparatus. As a result, the heat transfer fluid may not be mixed with the cleaning agent to maintain cleaning capacity of the cleaning agent.

A wire bonding device for bonding a wire to a target includes: a prediction part which predicts, based on time-series data of a diagnosis result regarding an operation of the wire bonding device, a transition of a change from the diagnosis result in an initial state; and a setting part which sets a time point at which the prediction part predicts that an amount of change from the diagnosis result in the initial state reaches a first threshold value as a time point for performing maintenance of the wire bonding device. The wire bonding device allows the maintenance to be performed suitably.

A method of fabricating a semiconductor package includes disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer. A bonding tool is disposed on the interposer. The bonding tool includes a first region and a second region outside of the first region. The second region of the bonding tool corresponds to the pad part. The interposer and the substrate are bonded to each other.

An electronic component mounting device (1) comprises: an electronic component supply unit (20) that supplies an electronic component having a bump electrode (EB); a transfer stage (31) that accumulates a flux (FX); a mounting stage (41) on which a substrate (BD) is placed; a plurality of heads that can each pick up an electronic component (CP); and a control unit (10) that controls movement of the plurality of heads. The control unit (10) is configured so as to cause each of the plurality of heads to function as a dipping head that dips the bump electrode (EB) of the electronic component (CP) into the flux (FX) accumulated on the transfer stage (31), or as a bonding head that mounts the electronic component (CP) to the substrate (BD) on the mounting stage (41) with the bump electrode (EB) interposed therebetween.

The present invention relates to a high-precision substrate alignment method and system for semiconductor bonding, utilizing advanced sensory systems, digital twin technology, and machine learning. Unique alignment marks, such as 2D barcodes and varied critical dimension (CD) grids, capture precise positional information of substrates in 3D space. This system optimizes movement trajectories for substrate bonding, significantly improving alignment accuracy and process efficiency.