A package structure including a semiconductor die, a redistribution layer, a plurality of antenna patterns, a die attach film, and an insulating encapsulant is provided. The semiconductor die have an active surface and a backside surface opposite to the active surface. The redistribution layer is located on the active surface of the semiconductor die and electrically connected to the semiconductor die. The antenna patterns are located over the backside surface of the semiconductor die. The die attach film is located in between the semiconductor die and the antenna patterns, wherein the die attach film includes a plurality of fillers, and an average height of the die attach film is substantially equal to an average diameter of the plurality of fillers. The insulating encapsulant is located in between the redistribution layer and the antenna patterns, wherein the insulating encapsulant encapsulates the semiconductor die and the die attach film.

A packaging structure and a formation method thereof are provided. The packaging structure includes a carrier board, and a plurality of semiconductor chips adhered to the carrier board. Each semiconductor chip has a functional surface and a non-functional surface opposite to the functional surface, and a plurality of pads are formed on the functional surface of a semiconductor chip of the plurality of chips. A metal bump is formed on a surface of a pad of the plurality of pads, and a first encapsulation layer is formed on the functional surface. The packaging structure also includes a second encapsulation layer formed over the carrier board.

Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attached to its second side opposite to the first side. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in a wet process. The biodegradable structure can be configured to couple the memory controller die with an interface die. In this manner, when the biodegradable structure disintegrates (e.g., dissolve) in the wet process, the memory controller carrying the memory dies can be separated from the interface die to reclaim the memory controller with the memory dies and the interface die.

A method for making a semiconductor device is provided. The method includes: providing a package including: a substrate including a top surface and a bottom surface; a top electronic component mounted on the top surface of the substrate; at least one conductive pillar formed on the bottom surface of the substrate; and a protection layer attached on the bottom surface of the substrate and covering the at least one conductive pillar; providing a molding apparatus including a top chase and a bottom chase, wherein a molding material is held in the bottom chase; attaching the protection layer onto the top chase of the molding apparatus; and moving the top chase and the bottom chase close to each other to compress the molding material to cover the top electronic component on the top surface of the substrate, thereby forming a top encapsulation on the top surface of the substrate.

In one example, an electronic device, comprises a substrate comprising a dielectric structure and a conductive structure, an electronic component over a top side of the substrate, wherein the electronic component is coupled with the conductive structure; an encapsulant over the top side of the substrate and contacting a lateral side of the electronic component, wherein the encapsulant comprises a first trench on a top side of the encapsulant adjacent to the electronic component, a lid over the top side of the encapsulant and covering the electronic component; and an interface material between the top side of the encapsulant and the lid, and in the first trench. Other examples and related methods are also disclosed herein.

Provided is a method for forming a partial shielding for an electronic assembly, comprising: providing an electronic assembly mounted on a mother board, wherein the electronic assembly comprises a substrate, and at least one electronic component and a conductive pattern mounted on a top surface of the substrate; disposing a mask onto the substrate to cover the at least one electronic component; forming an encapsulant layer on the mother board to encapsulate at least the electronic assembly; forming a trench through the encapsulant layer to expose at least a portion of the conductive pattern and at least a portion of lateral surfaces of the mask; forming a shielding layer on the mother board to cover the encapsulant layer and fill in the trench; and detaching the mask from the mother board.

A semiconductor package may include a first package including a first substrate, a first semiconductor chip mounted on the first substrate, and a second substrate on the first semiconductor chip, the first package having a center region, a first edge region surrounding the center region, and a second edge region surrounding the first edge region in a plan view, dummy balls disposed on the center region and the second edge region of the first package, connection terminals disposed on the first edge region of the first package, and a second package including a third substrate disposed on the dummy balls and the connection terminals and a second semiconductor chip mounted on the third substrate. The dummy balls may be in contact with the second substrate and may be spaced apart from the third substrate, and the connection terminals may be coupled to the second and third substrates.

A semiconductor package, includes: a first semiconductor chip including first connection pads on the first front surface, and through electrodes extending perpendicularly to the first rear surface and electrically connected to at least a portion of the first connection pads; a second semiconductor chip including second connection pads on the second front surface, and on the first rear surface so that the second rear surface faces the first semiconductor chip; a dielectric layer on the second semiconductor chip; first conductive structures in the dielectric layer, and connecting the through electrodes of a first group and the second connection pads; second conductive structures in the dielectric layer, and having first and second ends, the first ends connected to the through electrodes of a second group and at least a portion of the second ends thereof being exposed from the dielectric layer; at least one third semiconductor chip including third connection pads on the third front surface, and on the dielectric layer so that the third rear surface faces the second semiconductor chip; conductive wires connecting the second conductive structures and the third connection pads.

A package comprising a package substrate; a first integrated device coupled to the package substrate through a first plurality of solder interconnects; an encapsulation layer at least partially encapsulating the first integrated device; a plurality of post interconnects at least partially located in the encapsulation layer; a metallization portion coupled to the plurality of post interconnects; a second integrated device coupled to the metallization portion through a second plurality of solder interconnects; an optical integrated device coupled to the package substrate; and an optical fiber coupled to the optical integrated device.

The present disclosure relates to a double-sided integrated circuit (IC) module, which includes an exposed semiconductor die on a bottom side. A double-sided IC module includes a module substrate with a top side and a bottom side. Electronic components are mounted to each of the top side and the bottom side. Generally, the electronic components are encapsulated by a mold compound. In an exemplary aspect, a portion of the mold compound on the bottom side of the module substrate is removed, exposing a semiconductor die surface of at least one of the electronic components.