Provided is a tower lift including a frame extending in a vertical direction, a carriage configured to move along the frame, a first coil arranged on a first surface of the frame, the first surface facing the carriage, a second coil arranged on the first surface of the frame and separated from the first coil, a first magnet connected to the carriage and located between the first coil and the second coil, and a second magnet connected to the carriage, located between the first magnet and the second coil, and separated from the first magnet.

A chip transferring method includes steps of: providing a plurality of chips on a first load-bearing structure; measuring photoelectric characteristic values of the plurality of chips; categorizing the plurality of chips into a first portion of the plurality of chips and a second portion of the plurality of chips according to the photoelectric characteristic values of the plurality of chips, wherein the second portion of the plurality of chips comprise parts of the plurality of chips which photoelectric characteristic value falls within an unqualified range; removing the second portion of the plurality of chips from the first load-bearing structure; dividing the first portion of the plurality of chips into a plurality of blocks, wherein each of the plurality of blocks comprising multiple chips of the first portion of the plurality of chips; and transferring the first portion of the plurality of chips in one of the plurality of blocks to a second load-bearing structure in single-batch.

Provided is a tower lift, including: a body; a first carriage module and a second carriage module configured to be movable in a vertical direction along the body and each support objects to be transferred; a driving unit comprising a driving belt which vertically moves the first carriage module and the second carriage module and on which the first carriage module or the second carriage module is mounted; and a gap adjusting unit adjusting a gap between the first carriage module and the second carriage module.

Described examples include a material movement track having a base having a top surface, a first rail connected to the base and having a first major surface extending over the top surface, and a second rail connected to the base and having a second major surface extending over the top surface. The material movement track also has a first cover member extending from a first side of the base over the first rail and a second cover member extending from a second side of the base over the second rail and forming a gap between the first and second cover members.

Methods of transferring a substrate during a semiconductor device fabrication process include receiving the substrate at a mobile robot, moving the mobile robot with the substrate, and aligning the mobile robot with a mobile robot interface device, transferring the substrate from the mobile robot to the mobile robot interface device, and while transferring the substrate from the mobile robot to the mobile robot interface device, charging a battery of the mobile robot.

An overhead transport vehicle system includes an overhead transport vehicle including a traveler and a body supported by the traveler via a suspension to hold an object to be transported, and a traveling rail including a slit, through which the suspension is movable when the traveler travels, and rolling portions along which traveling wheel rolls, and having a tubular shape including an internal space through which the traveler travels. In the internal space in a curved section, above a passing area through which the traveling wheel rolling on the rolling portion on an outer side of a curve passes, a rising restriction portion, with which the traveling wheel having risen by a predetermined amount from the rolling portion comes into contact, extends along an extending direction of the traveling rail.

A substrate loading apparatus includes a pickup apparatus configured to move a magazine in a first direction, a second direction and a third direction, an elevator defining a plurality of waiting spaces, a stage configured to support the magazine, and an insert apparatus configured to transfer substrates in the magazine. At least one of the plurality of waiting spaces of the elevator is configured to selectively receive the magazine, and the pickup apparatus is spaced apart from the elevator and the stage in the third direction.

A substrate transfer system includes a main body on which a carrier configured to store a substrate is loaded, a first wheel assembly disposed inside the main body and configured to travel along a first rail extending in a first direction, a second wheel assembly disposed inside the main body and configured to travel along a second rail extending in a second direction different from the first direction, and a lift disposed inside the main body and configured to move the first wheel assembly up and down between a first lower position at which the first wheel assembly is in contact with the first rail and a first upper position higher than the first lower position, and to move the second wheel assembly up and down between a second lower position at which the second wheel assembly is in contact with the second rail and a second upper position higher than the second lower position.

A first transfer device and a second transfer device are configured to transfer a first substrate and a second substrate in a normal pressure atmosphere. A third transfer device is configured to transfer the first substrate and the second substrate in a decompressed atmosphere. A load lock chamber has accommodation sections allowed to accommodate therein the first substrate and the second substrate, and is allowed to switch an inside of the accommodation sections between the normal pressure atmosphere and the decompressed atmosphere. Multiple gates are respectively disposed on three different sides of the load lock chamber, and allowed to open or close the load lock chamber. The first transfer device, the second transfer device, and the third transfer device carry the first substrate and the second substrate into/out of the load lock chamber through different gates among the multiple gates.

System and method for cross-fab wafer transportation are provided. An exemplary system includes a first control unit coupled to an associated first automatic material handling system (AMHS), the first AMHS includes a first overhead transport (OHT) track comprising a first portion and a first vehicle movable along the first OHT track and carrying a container, the container is operable to carry semiconductor wafers therein. The system includes a second control unit coupled to an associated second AMHS, the second AMHS includes a second OHT track comprising a second portion adjacent to the first portion and a second vehicle movable along the second OHT track. When the first vehicle is within the first portion of the first OHT track and the second vehicle is within the second portion of the second OHT track, the first and second vehicles are operable to transfer the container directly from the first vehicle to the second vehicle.