A transport vehicle that transports a container while being suspended includes a lateral swing suppression device configured to abut against an outer side surface of the container that is suspended and held, and suppress a lateral swing of the container. The lateral swing suppression device includes an abutment roller configured to rotatably abut against the outer side surface of the container. A concave groove extending continuously over an entire periphery of an outer peripheral surface of the abutment roller is formed in a region corresponding to a convex portion of the container.

A container transport apparatus including an event recording unit suitable for the driving environment for a container transport vehicle in a semiconductor fabrication plant and a logistics transport system are provided. The container transport apparatus includes: a gripping module gripping a container with a plurality of substrates accommodated therein; an elevation module lifting up or down the gripping module; a driving module controlling driving wheels to drive on rails; a first control module controlling the gripping module, the elevation module, and the driving module; and an event recording unit continuously recording surroundings of the container transport apparatus and recording any events when the container transport apparatus is driving on the rails, wherein the event recording unit displays data on a screen of a manager terminal when displaying recorded images on the screen of the manager terminal.

A conveyance device includes: a container that contains a processing target; a conveyor that conveys the processing target along a predetermined conveyance path between the container and a processor that processes the processing target; an ionizer that ejects neutralization air toward the processing target conveyed by the conveyor; and a controller that controls the conveyor.

A conveyance apparatus includes: a mast; and a lifting body supported by the mast, wherein the lifting body includes: a base; a transfer mechanism that is provided in the base, the transfer mechanism including a placement unit and an expandable unit that moves the placement unit between an inner position on the base and an outer position deviated from the base in a direction intersecting an up-down direction; and a suppression member that suppresses separation of a storage container from the placement unit by an inertial force acting upward or obliquely upward, the suppression member fixed to the base in a state of being separated upward by a predetermined distance from the base in such a manner as to be positioned above the storage container with a gap in a state where the placement unit on which the storage container is placed is at the inner position.

A working system for a semiconductor packaging process includes a machine equipment, a supply unit and a return device. The supply unit is correspondingly connected to the machine equipment and includes an input device and an output device. The return device is connected to the input device and the output device. As such, a magazine is transferred from the input device to the output device via the return device, thereby accelerating the operation speed of a production line.

Semiconductor manufacturing equipment includes a substrate supply unit to which a front opening unified pod (FOUP) is detachably coupled and accommodates a first substrate therein, a process chamber in which a process is performed on a second substrate, a stage provided between the process chamber and the substrate supply unit, the stage including a cooler configured to cool a third substrate and a transfer robot configured to transfer the substrates, and a control unit configured to control the transfer robot by comparing first time data with second time data, the first time data being an amount of time taken for the transfer robot to transfer the third substrate from the cooler to the substrate supply unit, and the second time data being an amount of time remaining before completion of the process performed in the process chamber.

Provided are a semiconductor wafer conveyor transport and a monotrack transportation system and method. The system includes a support frame, carrier gripping mechanism, monotrack vehicle, monotrack rotating turntable, track, and monotrack horizontal transfer device. The system integrates with a gripper-based transfer structure (L-type) to facilitate movement of carriers between the monotrack and the conveyor system using a load port transfer mechanism. The gripper moves bi-directionally to pick up the carriers from the monotrack vehicle and transfer them to the conveyor load port or vice versa. The gripper grabs both sides of the carrier's box, lifts the carrier via the inner lifting mechanism, and transfers the carrier from the loading position to the unloading position, or vice versa, within the transfer structure. The outer lifting mechanism lowers the carrier onto the monotrack vehicle, which transports it to a stocker or internal transfer system, rendering the carrier movement seamless and efficient.

A system according to the present disclosure includes a first fixed rail segment, a second fixed rail segment aligned with the first fixed rail segment along a first direction, a rotatable rail joint disposed between the first fixed rail segment and the second fixed rail segment along the first direction, a hanger mechanically coupled to the rotatable rail joint, a powered rotational mechanism housed in the hanger. The rotatable rail joint includes at least one rotational rail that is aligned with the first fixed rail segment and the second fixed rail segment when the rotatable rail joint rotates to an alignment position is not aligned with the first fixed rail segment and the second fixed rail segment when the rotatable rail joint rotates out of the alignment position.

A first transfer device and a second transfer device are configured to transfer a first substrate and a second substrate in a normal pressure atmosphere. A third transfer device is configured to transfer the first substrate and the second substrate in a decompressed atmosphere. A load lock chamber has accommodation sections allowed to accommodate therein the first substrate and the second substrate, and is allowed to switch an inside of the accommodation sections between the normal pressure atmosphere and the decompressed atmosphere. Multiple gates are respectively disposed on three different sides of the load lock chamber, and allowed to open or close the load lock chamber. The first transfer device, the second transfer device, and the third transfer device carry the first substrate and the second substrate into/out of the load lock chamber through different gates among the multiple gates.

A vacuum processing apparatus for performing a predetermined process on a workpiece in a depressurized state, including: a processing module including a vacuum processing chamber whose interior is depressurized and in which the process is performed on the workpiece; a vacuum transfer module including a vacuum transfer chamber whose interior is maintained in a depressurized state; a gas supply mechanism for supplying the gas for preventing at least oxidation into the vacuum transfer chamber; and a controller for controlling the gas supply mechanism to supply the gas into the vacuum transfer chamber in an idle state in which the process is not performed on the workpiece in the vacuum processing apparatus such that a first oxygen concentration in the vacuum transfer chamber in the idle state is adjusted to be lower than a second oxygen concentration the vacuum transfer chamber in a vacuum state.