A semiconductor package assembly, comprising: a first semiconductor package having at least one first electronic component exposed from its front surface; a second semiconductor package stacked on the first semiconductor package and having at least one second electronic component exposed from its front surface, wherein the first and second semiconductor packages define therebetween a first fluidic channel; and a lid stacked on the second semiconductor package; wherein the lid and the second semiconductor packages define therebetween a second fluidic channel to which the at least one second electronic component is exposed; wherein the second semiconductor package has openings passing therethrough to fluidly connect the first fluidic channel with the second fluidic channel, such that a coolant is capable of flowing within the first and second fluidic channels to dissipate heat generated by electronic components out of the semiconductor package assembly.

Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, the integrated cooling assembly comprises a semiconductor device and a cold plate directly bonded to a backside of the semiconductor device. The first side of the cold plate includes coolant channels, and a second side of the cold plate comprises at least two openings, defined by opening sidewalls extending away from the second side and towards the first side. The cavity sidewalls and the coolant channels of the first side run in a first direction, the at least two openings on the second side run in a second direction different from the first direction and overlap with portions of the coolant channels on the first side to form a continuous aperture between the second side and the first side of the cold plate.

Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, the integrated cooling assembly comprises a semiconductor device and a cold plate directly bonded to a backside of the semiconductor device. The first side of the cold plate includes coolant channels, and a second side of the cold plate comprises at least two openings, defined by opening sidewalls extending away from the second side and towards the first side. The cavity sidewalls and the coolant channels of the first side run in a first direction, the at least two openings on the second side run in a second direction different from the first direction and overlap with portions of the coolant channels on the first side to form a continuous aperture between the second side and the first side of the cold plate.

A cooling assembly is provided for dissipating heat generated by a semiconductor device. The assembly includes a cooler having a housing and a top plate that define an internal fluid channel. The cooler incorporates at least one reinforcement structure disposed within it, the structure composed of a reinforcement material that is different than a material of the top plate or the housing. The reinforced architecture increases the structural rigidity of the cooler to mitigate warpage and the potential for die cracking or delamination.

The present technology pertains to a packaged microchip that includes an integrated cold plate. The packaged microchip includes a substrate and a die, which can be a semiconductor chip on which an integrated circuit has been fabricated. The die has a thermal-interface surface on which a thermal interface material (TIM) is provided. The integrated cold plate is fixed to the substrate. The cold plate has a die surface and a heat-dissipating surface. The die surface contacts the TIM such that the TIM is sandwiched between the die and the heat-removal member. The heat-removal member is monolithic and is configured to remove heat from the die via heat transfer from the heat-removal member to a fluid.

An intelligent power module includes: a heat radiation device; an attachment frame disposed on a mounting surface of the heat radiation device; a power semiconductor module mounted on the attachment frame and configured to seal a semiconductor device; and a drive circuit part mounted on the power semiconductor module via a heat insulating sheet and configured to drive the power semiconductor module.

The invention relates to a semiconductor device (1) comprising a stack of chips (C1; C) arranged in successive levels along a stacking direction, each chip extending in a main plane perpendicular to the stacking direction. The stack (E) comprises a plurality of chips (C1) of a first type comprising a first portion (P1) and a second portion (P2) each extending in the main plane, the first portion (P1) being liable to release more heat than the second portion (P2) when the chip is operating. Each chip of the first type (C1) is arranged in mechanical contact with a chip in an adjacent level of the stack (E) by way of a stacking surface that extends only over its second portion (P2), such that its first portion (P1) forms a projecting part able to be exposed to a cooling fluid.