A quantum device includes a quantum chip, an interposer including a first wiring layer over which the quantum chip is mounted, a socket disposed to face the first wiring layer and including a plurality of terminals, and a board having a second wiring layer facing the first wiring layer. Each of the plurality of terminals electrically connects the first wiring layer and the second wiring layer, the socket includes a recessed unit housing the quantum chip, and the recessed unit has a first metal surface covering at least a part of the quantum chip.

An electronic device is provided. The electronic device includes a shield can including a first cavity and a first opening to communicate with the first cavity, an electronic component disposed in the first cavity, a shielding sheet disposed at an upper portion of the shield can, communicating with the first cavity, and defining a second cavity, the shielding sheet including a first part contacting the shield can, a heat-dissipation member disposed on the shielding sheet to close the second cavity, and a thermal interface material (TIM) disposed between the heat-dissipation member and the electronic component. The shield can, the shielding sheet, and the heat-dissipation member are electrically connected to each other, the electronic component, the TIM, and the heat-dissipation member are thermally connected to each other, the first cavity has a first width, and the second cavity has a second width, greater than the first width.

A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.

The present disclosure describes a network switch design that includes a vertical switch circuit board that is mounted parallel to the front panel of the network switch. The vertical circuit board supports switch chip(s) to process and forward packets and pluggable module connectors to receive pluggable optics modules that provide connections to other network switches. The pluggable module connectors are horizontally oriented to facilitate routing of electrical signal traces. The arrangement of the circuit board, switch chip(s) and pluggable module connectors achieves reduced lengths for the electrical signal traces that connect the switch chip(s) to the pluggable module connectors. The design improves cooling by providing separate airflow regions between the switch chip heatsink(s) and the optics modules.

A semiconductor device of an embodiment includes a main body which has a substrate and a chip mounted on a device surface facing one side in a first direction among outer surfaces of the substrate. The semiconductor device includes a housing which accommodates the main body. The semiconductor device includes a heat transfer pin. The housing has a lid member that faces the device surface. The heat transfer pin is held by the lid member and extends from the lid member toward the chip.

A thermal management device includes a body, a fluid movement structure, and a movement mechanism. The body is configured to receive heat from a heat-generating component at a proximal surface, and the fluid movement structure is on a distal surface of the body that is distal to the proximal surface, wherein the fluid movement structure is configured to direct fluid flow of a working fluid and the body is configured to transfer heat to the working fluid. The movement mechanism is configured to move the fluid movement structure relative to the body.

A mesh woven structure with capillary action is applied to a two-phase fluid heat dissipation unit. The mesh woven structure includes multiple latitudinal lines and multiple longitudinal lines. At least two longitudinal lines are selectively arranged as a longitudinal line set. The mesh woven structure is woven from the single latitudinal line and one cooperative longitudinal line set, which sequentially repeatedly intersect (and overlap with) each other. Accordingly, the number of the voids of the mesh woven structure is increased so that the mesh woven structure has better capillary attraction and water collection (containing) ability to greatly enhance the heat transfer performance.

A heat-transfer member (1) includes: a base material (2) that is composed of an inorganic compound containing a metal or a metal element; and an oxide layer (3) that is composed of an oxide or oxides of the metal element contained in the base material (2) and is formed on the base material (2). The oxide layer (3) has a plurality of pores (31), which include: first portions (312) that have openings (311) on the surface of the heat-transfer member (1), the openings (311) having an average opening diameter of 5 nm or larger and 70 nm or smaller; and second portions (313) that have an average pore diameter larger than the average opening diameter of the first portions (312) and are continuous with the first portions (312). The average depth of the second portions (313) is 600 nm or more and 20 m or less.

A heat sink including a base portion having a first surface and a second surface facing the first surface, in which a heat-generating element is thermally connected to the second surface, and heat radiation fins provided upright on the first surface of the base portion. The base portion and the heat radiation fins are separate bodies, and at least a part of the thermally conductive member is embedded in the heat sink.

Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.