The present disclosure provides a semiconductor device. The semiconductor device includes a die stack, an intervening bonding layer, and a carrier structure. The intervening bonding layer is positioned on the die stack. The carrier structure is disposed on the intervening bonding layer opposite to the die stack. The carrier structure includes a heat dissipation unit configured to transfer heat generated from the die stack. The heat dissipation unit includes composite vias and conductive plates. Each of the composite vias includes a first through semiconductor via and a second through semiconductor via. The conductive plates are couple to the composite vias.

A semiconductor structure includes: an electrode cover layer; a first conductive structure on the electrode cover layer; a contact structure, including a first and a first contact layer. The first contact layer is in contact with the first conductive structure, the bottom of the second contact layer is in contact with the top of the first contact layer, the width of the first contact layer is greater than the width of the bottom of the second contact layer, the lower surface of the contact structure is not lower than the lower surface of the electrode cover layer, and the resistivity of the first conductive structure is not greater than that of the contact structure and is not greater than that of the electrode cover layer.

The present disclosure provides a semiconductor structure, including a substrate, a gate structure over the substrate, including a work function layer over the substrate, a dielectric layer at least partially surrounding the gate structure, and a capping layer over the gate structure, wherein a bottom of the capping layer includes at least one protrusion protruding toward the substrate.

An integrated circuit device includes a substrate, a first transition metal dichalcogenide layer over the substrate, a dielectric layer over the first transition metal dichalcogenide layer, a first gate electrode, and a first source contact and a first drain contact. The first transition metal dichalcogenide layer has a surface roughness greater than 0.5 nm and less than 1 nm. The first gate electrode is over the dielectric layer and a first portion of the first transition metal dichalcogenide layer. The first source contact and the first drain contact are respectively connected with a second portion and a third portion of the first transition metal dichalcogenide layer. The first portion of the first transition metal dichalcogenide layer is between the second and third portions of the first transition metal dichalcogenide layer.

According to some embodiments of the inventive concepts, an integrated circuit device may be provided. The integrated circuit device may include a lower conductive line, a conductive via on the lower conductive line and a stopping pattern between the lower conductive line and the conductive via. A side surface of the stopping pattern may be aligned with the side surface of the lower conductive line and the side surface of the conductive via.

The present disclosure relates to a method of forming an interconnect structure that eliminates a separate deep via patterning process to simplify the fabrication process. In some embodiments, a first dielectric layer is formed over a first metal line and patterned to form a through-hole exposing a first contact region of the first metal line. A second dielectric layer is deposited and patterned to form a first via-hole connecting to the through-hole and a second via-hole exposing a second contact region of the second metal line from a layout view. A first via is formed on the first contact region extending to a first upper surface of the second dielectric layer, and a second via is formed on the second contact region extending to a second upper surface of the second dielectric layer.

Semiconductor structures and methods of forming the same are provided. In one embodiment, a semiconductor structure includes an active region over a substrate, a gate structure disposed over the active region, and a gate contact that includes a lower portion disposed over the gate structure and an upper portion disposed over the lower portion.

Integrated circuit interconnect structures including an interconnect line metallization feature subjected to one or more chalcogenation techniques to form a cap may reduce line resistance. A top portion of a bulk line material may be advantageously crystallized into a metal chalcogenide cap with exceptionally large crystal structure. Accordingly, chalcogenation of a top portion of a bulk material can lower scattering resistance of an interconnect line relative to alternatives where the bulk material is capped with an alternative material, such as an amorphous dielectric or a fine grained metallic or graphitic material.

A microelectronic device comprises a stack structure comprising alternating conductive structures and insulative structures arranged in tiers, each of the tiers individually comprising a conductive structure and an insulative structure, strings of memory cells vertically extending through the stack structure, the strings of memory cells comprising a channel material vertically extending through the stack structure, and conductive rails laterally adjacent to the conductive structures of the stack structure. The conductive rails comprise a material composition that is different than a material composition of the conductive structures of the stack structure. Related memory devices, electronic systems, and methods are also described.

A method of forming a semiconductor structure includes forming a semiconductor device over a substrate, forming a combination of a connection-level dielectric layer and a connection-level metal interconnect structure over the semiconductor device, where the connection-level metal interconnect structure is electrically connected to a node of the semiconductor device and is embedded in the connection-level dielectric layer, forming a line-and-via-level dielectric layer over the connection-level dielectric layer, forming an integrated line-and-via cavity through the line-and-via-level dielectric layer over the connection-level metal interconnect structure, selectively growing a conductive via structure containing cobalt from a bottom of the via portion of the integrated line-and-via cavity without completely filling a line portion of the integrated line-and-via cavity, and forming a copper-based conductive line structure that contains copper at an atomic percentage that is greater than 90% in the line portion of the integrated line-and-via cavity on the conductive via structure.