Optical inspection of the surface of a substrate may take place in a factory interface where an aligner rotates the substrate to identify an alignment mark. While rotating, light may also be reflected off the surface of the substrate and captured by to identify defects or other variations on the substrate surface. However, the edge of the substrate often includes a bevel, and light directed at the edge of the substrate does not reflect off the bevel into the camera uniformly. Therefore, multiple light sources may be used simultaneously. For example, one light source may be directed perpendicularly at the edge of the bevel while another light source is directed at the bevel edge and configured such that light reflects off of the bevel into the camera. This provides an image with uniform lighting that can be more effectively used to identify defects on the edge of the substrate.

A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder; a second moving mechanism configured to move the first imaging unit along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit along the second direction.

According to the present disclosure, there is provided a technique capable of substantially uniformizing the quality of each substrate by setting the position of the substrate in accordance with the process conditions for each step of the substrate processing. According to one aspect thereof, there is provided a substrate processing apparatus including: a support structure capable of supporting at least a substrate; and a controller provided with a memory in which a recipe capable of setting a support position of the substrate is stored, wherein the controller is configured to be capable of controlling an operation of elevating and lowering the support structure such that the support position set in the recipe is located at a predetermined reference position.

A method of controlling a processing apparatus includes providing the processing apparatus including a chamber; a rotary table accommodated within the chamber, including a stage on which a plurality of substrates is to be placed, and rotatable and movable in an up and down direction; a heater provided below the rotary table; and a temperature sensor that measures a temperature of the rotary table. The method further includes acquiring the temperature measured by the temperature sensor; and moving up and down a position of the rotary table according to a result of comparison between the acquired temperature and a target temperature during an idle time during which a specific process is not performed in the chamber.

A first substrate holder holds an outer peripheral end of a substrate. A second substrate holder holds a lower-surface center region of the substrate by suction at a position farther downward than the first substrate holder. The second substrate holder and the lower-surface brush are provided on a mobile base that is movable in a horizontal direction. The mobile base is moved between a position at which the lower-surface brush is opposite to a lower-surface outer region of the substrate and a position at which the lower-surface brush is opposite to the lower-surface center region of the substrate. The lower-surface center region of the substrate held by the first substrate holder is cleaned. At this time, a height position of the substrate is higher than an upper end portion of a processing cup. The lower-surface outer region of the substrate held by the second substrate holder is cleaned. At this time, a height position of the substrate is lower than the upper end portion of the processing cup.