Provided is an industrial magazine rack in which a biasing mechanism for biasing a stopper member to a closed position or an open position is prevented from coming into contact with a board-shaped member housed in a rack main body. The industrial magazine rack includes a base fixed to a lower surface of a top plate or an upper surface of a bottom plate, a pivot bracket for supporting the stopper member, which is supported by the base so as to be pivotable on a pivot axis extending in a vertical direction on an outside of a side plate, and a torsion coil spring having a first end portion mounted to the base on an outside of a pivot center of the pivot bracket in a left and right direction and a second end portion mounted to the pivot bracket between the pivot center of the pivot bracket and the first end portion in the left and right direction, and the torsion coil spring is formed to bias the stopper member toward the closed position when the second end portion is on one side of an imaginary line connecting the pivot center of the pivot bracket and the first end portion, and bias the stopper member toward the open position when the second end portion is on another side of the imaginary line.

An object of the present invention is to provide a dry ice cleaning apparatus for a semiconductor wafer and a method for cleaning a semiconductor wafer that can reduce the amount of particles remaining on the surface of a semiconductor wafer, suppress a decrease of cleaning effects due to ice formation, and continuously and effectively clean a large amount of semiconductor wafers. The present invention provides a dry ice cleaning apparatus for a semiconductor wafer including a cleaning chamber (1) into which the semiconductor wafers (W) are sequentially carried in and which has an internal space (11) for cleaning the semiconductor wafers (W), an inject cleaning nozzle (5) that is disposed in the internal space (11) of the cleaning chamber (1) and injects the dry ice (D) toward the cleaning surface of the semiconductor wafer (w), and a transfer robot (2) that is disposed in the internal space (11) of the cleaning chamber (1) and sequentially carries the semiconductor wafers (W) from the outside of the cleaning chamber (1) into the internal space (11); and wherein while the transfer robot (2) holding the semiconductor wafer (W) carried into the internal space (11) non-horizontally, the inject cleaning nozzle (5) injects the dry ice (D) onto the semiconductor wafer (W).

A substrate storing container includes a lid body side substrate support portion. The lid body side substrate support portion has support flat surfaces respectively configured to contact with peripheral surfaces of the edge portions of the plurality of substrates so as to support the substrates, and the support flat surfaces that contact with the peripheral surfaces of the edge portions of adjacent ones of the plurality of substrates have overlap portions adjacent to each other in a direction parallel to upper surfaces of the substrates.

A semiconductor wafer mapping apparatus comprising a frame forming a wafer load opening communicating with a load station for a substrate carrier disposed to hold more than one wafers vertically distributed in the substrate carrier for loading through the wafer load opening, a movable arm movably mounted to the frame so as to move relative to the wafer load opening and having at least one end effector movably mounted to the movable arm to load wafers from the substrate carrier through the wafer load opening, an image acquisition system including an array of cameras arranged on a common support and each camera fixed with respect to the common support that is static with respect to each camera of the array of cameras, wherein each respective camera is positioned with a field of view disposed to view through the wafer load opening with the common support positioned by the movable arm.

A semiconductor substrate carrying container, such as a front opening unified pod or shipping box, that includes a container shell having a plurality of walls, a front, and a rear, the plurality of walls defining an interior space that is sized to be able to receive a plurality of semiconductor substrates or trays, and a support structure configured to receive the plurality of semiconductor substrates or trays. The support structure includes at least one support wall that is formed by a plurality of corrugation portions provided along opposite sides of a centerline along a vertical plane at a center of the at least one support wall.

A substrate carrier includes a base and a cassette, where the cassette is fixed to the base. The cassette can formed integrally with the base, attached to the base using fasteners, attached to the base through a mechanical interface or otherwise attached. The base includes features configured to receive alignment features on automation for handling the substrate carrier. The features configured to receive the alignment features can be three channels. The substrate carrier can be included in a substrate container having a pod dome configured to receive the base to enclose an open end, the base being a pod door of the substrate container.

A substrate processing apparatus includes an O-ring defined by a central axis, a first guide ring located closer to the central axis than is the O-ring, and a second guide ring located further from the central axis than is the O-ring. A thickness of each of the first guide ring and the second guide ring becomes progressively greater further from the central axis.

A method of manufacturing a semiconductor device includes placing a substrate in a housing, supplying first gas containing molybdenum to the housing to form a film that contains molybdenum, on the substrate, removing the substrate with the formed film from the hosing, and then supplying second gas containing chlorine to the housing to remove molybdenum deposited on a surface of the housing.