A method of manufacturing an electronic device includes: providing a vapor generating chamber that accommodates a heat transfer fluid; providing a substrate stage within the vapor generating chamber, the substrate stage including a seating surface and suction passages penetrating the substrate stage to be open to the seating surface; loading a substrate on the substrate stage, wherein electronic components are disposed on the substrate via bumps; generating at least a partial vacuum in the suction holes to suction-support the substrate on the seating surface; heating the heat transfer fluid to generate saturated vapor within the vapor generating chamber; and soldering the bumps using the saturated vapor.

A collet for die attaching includes a first portion, a second portion and a third portion. The first portion includes a plate portion including a first through hole extending therethrough and having first and second surfaces opposite to each other in a vertical direction, and a protrusion portion on the second surface of the plate portion and protruding downwardly in the vertical direction. The second portion is under the first portion, and has first and second surfaces opposite to each other in the vertical direction and includes a second through hole extending therethrough and overlapping the protrusion portion of the first portion in the vertical direction. The third portion is between the first and second portions, and contacts the second surface of the plate portion and the first surface of the second portion.

A bond head assembly includes a collet and a planar compliant locating structure having a plane. The collet is operative to hold a die during a bonding process. The planar compliant locating structure includes a first flexural element that is positioned to contact a first side surface of the collet and a second flexural element that is positioned to contact a second side surface of the collet. The first and second side surfaces of the collet are substantially orthogonal to each other. Each of the first and second flexural elements is arranged such that a portion thereof is deflectable by movement of the collet against the flexural element, thereby causing the first or second flexural element to exert a biasing force against the first or second side surface of the collet along the plane of the compliant locating structure to restrict positional shifts of the collet towards the flexural element.

A bond head assembly includes a collet and a planar compliant locating structure having a plane. The collet is operative to hold a die during a bonding process. The planar compliant locating structure includes a first flexural element that is positioned to contact a first side surface of the collet and a second flexural element that is positioned to contact a second side surface of the collet. The first and second side surfaces of the collet are substantially orthogonal to each other. Each of the first and second flexural elements is arranged such that a portion thereof is deflectable by movement of the collet against the flexural element, thereby causing the first or second flexural element to exert a biasing force against the first or second side surface of the collet along the plane of the compliant locating structure to restrict positional shifts of the collet towards the flexural element.

A method and an apparatus for forming an electronic device is provided. The method comprises: providing a substrate; disposing at least one electronic component on the substrate via a solder paste; applying microwave radiation to the substrate to reflow the solder paste; applying a vacuum pressure to the substrate to remove voids formed within the solder paste during the reflowing of the solder paste; solidifying the solder paste into solder bumps between the substrate and the at least one electronic component.

A semiconductor device has a substrate. The substrate is disposed on a quartz carrier. An electrical component is disposed over the substrate opposite the quartz carrier. An epoxy-solder paste bump is disposed between the substrate and electrical component. The epoxy-solder paste bump comprises an epoxy and a solder powder disposed in the epoxy. Laser energy is applied to a surface of the substrate through the quartz carrier. The laser energy is converted to thermal energy to reflow the solder powder and cure the epoxy.

A die bonding tool includes a bond head that secures a semiconductor die against a planar surface of the bond head, an actuator system that moves the bond head and the semiconductor die towards a surface of a target substrate, and at least one contact sensor configured to detect an initial contact between a first region of the semiconductor die and the surface of the target substrate, where in response to detecting the initial contact between the semiconductor die and the target substrate, the actuator tilts the planar surface of the bond head and the semiconductor die to bring a second region of the semiconductor die into contact with the surface of the target substrate and thereby provide improved contact between the semiconductor die and the target substrate and more effective bonding including instances where the planar surface of the bond head and the target substrate surface are not parallel.