An electronic device includes an electronic component, a sealing resin, and a lead with an inner portion and an outer portion. The inner portion includes a die pad portion on which the electronic component is mounted, and a connecting portion that connects the outer portion and the die pad portion. The outer portion is disposed on a side of a first direction relative to the die pad portion. The connecting portion is connected to a side surface of the die pad portion. In a second direction, the center of the outer portion is disposed on a side of the second direction relative to the center of the die pad portion. The side surface includes a connecting section connected to the connecting portion and a pair of lateral sections disposed on both sides of the connecting section in the second direction.

An electronic device includes an electronic component, a sealing resin, and a lead with an inner portion and an outer portion. The inner portion includes a die pad portion on which the electronic component is mounted, and a connecting portion that connects the outer portion and the die pad portion. The outer portion is disposed on a side of a first direction relative to the die pad portion. The connecting portion is connected to a side surface of the die pad portion. In a second direction, the center of the outer portion is disposed on a side of the second direction relative to the center of the die pad portion. The side surface includes a connecting section connected to the connecting portion and a pair of lateral sections disposed on both sides of the connecting section in the second direction.

An electronic device including a first aluminum nitride film configured to cover a first surface of the first glass substrate, a second aluminum nitride film configured to cover a second surface of the first glass substrate, wiring layers disposed on the first aluminum nitride film, a plurality of first terminals disposed on the wiring layers, a first electronic component mounted on the plurality of first terminals, a plurality of second terminals disposed on the second aluminum nitride film, a second electronic component mounted on the plurality of second terminals, and a first through-hole wiring penetrating the first aluminum nitride film, the second aluminum nitride film, and the first glass substrate are included. A first reference potential terminal among the plurality of first terminals and a second reference potential terminal among the plurality of second terminals are electrically connected to each other via the first through-hole wiring.

An electrical device having a component which is at least partially covered with a gel, and a printed circuit board having an end face, on which a metal layer is applied, which metal layer covers the end face at least partially. The metal layer is at least partially covered by the gel, and the metal layer physically insulates the end face from the gel completely.

An electrical device having a component which is at least partially covered with a gel, and a printed circuit board having an end face, on which a metal layer is applied, which metal layer covers the end face at least partially. The metal layer is at least partially covered by the gel, and the metal layer physically insulates the end face from the gel completely.

A semiconductor module includes: a cooler; a substrate above the cooler and an insulating base material, a front surface conductor on one surface of the insulating base material, and a rear surface conductor on a rear surface of the insulating base material; a thermal-conductive member disposed between the cooler and the rear surface conductor; and a plurality of semiconductor elements each having a first main electrode joined to the front surface conductor and a second main electrode disposed on a surface opposite to a surface on which the first main electrode is disposed. Wiring patterns of the front surface conductor include one or more element mounting portions to which the first main electrodes of the semiconductor elements aligned in a predetermined direction are commonly connected. One of the element mounting portions is disposed in a central region of the substrate in an orthogonal direction orthogonal to the predetermined direction.

A semiconductor module includes: a cooler; a substrate above the cooler and an insulating base material, a front surface conductor on one surface of the insulating base material, and a rear surface conductor on a rear surface of the insulating base material; a thermal-conductive member disposed between the cooler and the rear surface conductor; and a plurality of semiconductor elements each having a first main electrode joined to the front surface conductor and a second main electrode disposed on a surface opposite to a surface on which the first main electrode is disposed. Wiring patterns of the front surface conductor include one or more element mounting portions to which the first main electrodes of the semiconductor elements aligned in a predetermined direction are commonly connected. One of the element mounting portions is disposed in a central region of the substrate in an orthogonal direction orthogonal to the predetermined direction.

A semiconductor device for a power conversion circuit includes a first main terminal, a second main terminal, a signal terminal, a substrate, a semiconductor element and a snubber circuit. The substrate has an insulating base material, a first wiring disposed on one surface of the insulating base material and electrically connected to the first main terminal, and a second wiring disposed on the one surface and electrically connected to the second main terminal. The semiconductor element is electrically connected to the first wiring. The snubber circuit includes a capacitor and electrically bridges the first wiring and the second wiring. The substrate has a signal wiring that is disposed between the semiconductor element and the snubber circuit and electrically connects the signal terminal and the semiconductor element.

A semiconductor device for a power conversion circuit includes a first main terminal, a second main terminal, a signal terminal, a substrate, a semiconductor element and a snubber circuit. The substrate has an insulating base material, a first wiring disposed on one surface of the insulating base material and electrically connected to the first main terminal, and a second wiring disposed on the one surface and electrically connected to the second main terminal. The semiconductor element is electrically connected to the first wiring. The snubber circuit includes a capacitor and electrically bridges the first wiring and the second wiring. The substrate has a signal wiring that is disposed between the semiconductor element and the snubber circuit and electrically connects the signal terminal and the semiconductor element.

A semiconductor device includes a resin housing, a substrate, a plurality of semiconductor elements, and a signal terminal. Each of the semiconductor elements has a first main electrode on a first surface, a second main electrode and a pad on a second surface opposite to the first surface. The first main electrodes are joined to a wiring of the substrate. The signal terminal is inserted in the housing, and electrically connected to the pads. The signal terminal includes a branch terminal. The branch terminal has a single first connection portion projecting from the housing to be connected to an external device, a plurality of second connection portions exposed from the housing and individually connected to the pads having a same function of the semiconductor elements, and a coupling portion disposed within the housing and electrically connecting the first connection portion and the second connection portions.