H10P72/57

Wafer aligner

A semiconductor wafer transport apparatus includes a frame, a transport arm movably mounted to the frame and having at least one end effector movably mounted to the arm so the at least one end effector traverses, with the arm as a unit, in a first direction relative to the frame, and traverses linearly, relative to the transport arm, in a second direction, and an edge detection sensor mounted to the transport arm so the edge detection sensor moves with the transport arm as a unit relative to the frame, the edge detection sensor being a common sensor effecting edge detection of each wafer simultaneously supported by the end effector, wherein the edge detection sensor is configured so the edge detection of each wafer is effected by and coincident with the traverse in the second direction of each end effector on the transport arm.

Compact optical microscope, metrology device comprising the optical microscope and a wafer positioning metrology apparatus comprising the metrology device

An optical microscope (1) is provided herewith that is configured to provide an image in an image plane (3) of an object in an object plane (5). The optical microscope comprises in an order along an optical axis (6) from the object plane to the image plane, a first lens (7), a second lens (11) and a third lens (14). The first lens (7) has a first lens surface (8) at the side of the object plane and a second lens surface (9) at a side of the image plane, the first lens surface having a first semi-reflective coating (10). The second lens (11) has a third lens surface (12) at the side of the object plane and a fourth lens surface (13) at a side of the image plane. The third lens (14) has a fifth lens surface (15) at the side of the object plane and a sixth lens surface (16) at a side of the image plane, the sixth lens surface having a second semi-reflective coating (17). The optical microscope is compact and provides for a diffraction-limited performance (MTF) over the full field of view with low distortion and low field curvature.

MANUFACTURING DEVICE AND MANUFACTURING METHOD FOR DISPLAY PANEL
20260026148 · 2026-01-22 ·

A manufacturing device of a display panel includes: a support portion on which a display substrate is mounted, a mask member disposed on a front surface of the support member and defining first openings corresponding to a transmission area of a laser light, a support member disposed on the display substrate and defining a plurality of second openings formed in an area corresponding to donor substrates disposed on the display substrate, respectively, a pressing portion including a pressing member for pressing the support member and the donor substrates disposed on the display substrate, and a laser irradiation portion disposed on an upper portion of the mask member for irradiating the laser light to light emitting elements of the donor substrates. The support member has a height equal to a sum of a thickness of each of the donor substrates and a height of each of the light emitting elements.

DEPOSITION DEVICE, ELECTRONIC DEVICE AND METHOD OF DEPOSITION FOR DISPLAY DEVICE

A deposition device for a display device includes: a chamber, a deposition source in the chamber, a stage on the deposition source; a mask structure on the stage; a substrate tray on the mask structure; a magnet plate on the substrate tray; a transport track passing through a first gate of the chamber and a second gate of the chamber and disposed inside the chamber and outside the chamber, a first carrier transporting the mask structure along the transport track; and a second carrier transporting the substrate tray along the transport track.

DEPOSITION METHOD, DEPOSITION APPARATUS, AND ELECTRONIC DEVICE MANUFACTURED BY USING THE DEPOSITION APPARATUS
20260068593 · 2026-03-05 ·

Provided are a deposition method, a deposition apparatus, and an electronic device manufactured by using the deposition apparatus. The deposition method includes forming a plurality of sensors on a substrate or a deposition mask which measure gaps between the substrate and the deposition mask, positioning the substrate on the deposition mask, measuring the gaps between the substrate and the deposition mask using the plurality of sensors, adjusting a parallelism between the substrate and the deposition mask based on the measuring of the gaps between the substrate and the deposition mask, and providing a deposition material onto the substrate through the deposition mask, wherein providing the deposition material forms a deposition material layer on the substrate.

Deposition apparatus

A deposition apparatus includes a mask, a mask frame, a stage disposed on a rear surface of the mask frame, and first to third external force applying parts disposed on the stage. Each of the first portion and the second portion includes a support and a driving part which moves the support. The first to third external force applying parts applies external force to the mask frame to control a shape of the mask frame.