Disclosed is a method for treating a substrate, on which a plurality of reference marks and a pattern are formed. The method includes a process preparing operation, a location information acquiring operation of acquiring information on an actual location of the pattern, and a process executing operation of supplying a treatment liquid to the substrate, and heating the substrate by irradiating laser light to the pattern on the substrate, to which the treatment liquid is applied, the location information acquiring operation includes acquiring information on actual locations of, among the plurality of reference marks, at least three reference marks, and acquiring information of the actual location of the pattern through the information of the actual locations of the reference marks.

The present disclosure relates to a substrate transfer device for sensing deflection of an end-effector and a substrate processing apparatus having the same. The substrate transfer device includes: an end-effector extending in a first direction and supporting a substrate; an end-effector hand connected with one side in the first direction of the end-effector; a horizontal movement unit connected with the end-effector hand and moving the end-effector in the first direction; and a deflection sensing unit including a light emitting part and a light receiving part, which are respectively disposed at both sides of a movement path of the end-effector, and sensing deflection of the end-effector.

A semiconductor manufacturing apparatus includes a first chuck that has a first surface and a second surface opposite each other and receives a first substrate on the first surface, a second chuck that has a third surface and a fourth surface opposite each other and receives a second substrate on the third surface, a first imaging device connected to one side of the first chuck, and a second imaging device connected to one side of the second chuck. Each of the first imaging device and the second imaging device includes a light blocking part, and the light blocking part blocks a first portion of reflected light reflected from a first alignment key on the first substrate or a second alignment key on the second substrate.

Various embodiments of the present disclosure are directed towards a method. The method includes providing a first semiconductor workpiece and a second semiconductor workpiece onto a platform. A plurality of positioning structures move the second semiconductor workpiece over the first semiconductor workpiece while moving from a plurality of reference positions to a plurality of first positions. A bonding apparatus is operated to bond the second semiconductor workpiece to the first semiconductor workpiece. The positioning structures are moved from the plurality of reference positions to a plurality of second positions. The positioning structures physically contact an outer perimeter of the first semiconductor workpiece and/or an outer perimeter of the second semiconductor workpiece while at the plurality of second positions. A shift value is determined between the first semiconductor workpiece and the second semiconductor workpiece based on a comparison between the plurality of first positions and the plurality of second positions.

A robot system includes a controller configured or programmed to perform a position identification control without stopping rotation of a mount performed to detect a mark, and perform an alignment control without stopping the rotation of the mount and while maintaining a rotation direction of the mount after a position of the mark is identified.

A substrate trimming apparatus includes a support configured to support a bonding substrate including at least two substrates bonded to each other, a waterjet cutting unit arranged to face an upper surface of the support and configured to trim an edge area of the bonding substrate by discharging pressurized fluid, and a camera unit configured to sense the trimmed edge area of the bonding substrate, in which the waterjet cutting unit includes a water body through which ultrapure water passes, a mixing tube coupled to a lower portion of the water body, and an abrasive supplying unit configured to supply an abrasive, and the waterjet cutting unit is configured to discharge at least one of the ultrapure water or a mixture of the ultrapure water and the abrasive towards the edge area of the bonding substrate.

A system for determining an orientation of a device is provided that includes a diffraction grating arranged on a surface of the device. By impinging a collimated light beam onto the diffraction grating an m-th order light beam and an n-th order light beam are generated. By monitoring the positions on sensor surface at which these light beams are detected, orientation information concerning an orientation of the device can be determined.

A semiconductor structure includes a first layer, a second layer, and a third layer bonded together in a multi-layer stack. The first layer includes a first alignment section, the second layer includes a second alignment section, and the third layer includes a third alignment section and a fourth alignment section. The third alignment section is along a first X-ray path with the first alignment section and the fourth alignment section is along a second X-ray path with the second alignment section.

A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

Some devices, systems, and methods hold a periphery of a back surface of a plate with a flexible ring portion of a chuck assembly; apply a negative vacuum pressure to a central portion of the back surface of the plate to bow the central portion of the plate such that the back surface of the plate forms a convex surface and a front surface of the plate forms a concave surface; measure, at or near the periphery of the plate, distances between the plate and a reference location; and identify a location of a transition point of a tapered edge of the plate based on the measured distances.