A substrate processing apparatus includes: a semiconductor substrate including a base layer, a first layer on the base layer, a second layer on the first layer, and alignment marks in the first layer and the second layer; and a measuring apparatus configured to analyze the plurality of alignment marks of the semiconductor substrate. The alignment marks include first alignment keys in the first layer and second alignment keys in the second layer. In a plan view, the first alignment keys extend along a first horizontal direction, and the second alignment keys extend along a third horizontal direction,. The first alignment keys and the second alignment keys overlap along a vertical direction.

A substrate processing apparatus includes a substrate stage configured to support and rotate a substrate, a dispenser configured to eject a solution toward an edge of the substrate, and a heater configured to heat at least part of the edge of the substrate, wherein the dispenser and the heater are synchronized with an encoder signal of the substrate stage.

A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder; a second moving mechanism configured to move the first imaging unit along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit along the second direction.