Patent classifications
H10P72/30
Substrate transfer module and semiconductor manufacturing equipment
A substrate transfer module, which provides clean environment to prevent particles from moving to a substrate, and semiconductor manufacturing equipment including the same. The substrate transfer module of the semiconductor manufacturing equipment includes a transfer chamber providing a transfer space of the substrate, having a chamber groove lowered by a predetermined height from a bottom surface to form a gap with respect to the bottom surface, a guide member provided in an inside portion of the transfer chamber, and a substrate transfer robot configured to move along the guide member and to transfer the substrate.
Support unit, line storage unit, and transport system including the support unit
A support unit is provided. The support unit supports transport items, which include a first storage having two or more first vertices formed on a bottom thereof and a second storage having second vertices formed on a bottom thereof, but at different locations from the first vertices, and store articles including substrates or consumables for manufacturing a semiconductor device, and includes: a base part forming a bottom surface; first block parts provided on the base part and including first separation prevention surfaces, on which the first vertices are positioned, and which face or adjoin circumferential surfaces or corners of the first storage; and second block parts provided on the first block parts and including second separation prevention surfaces, on which the second vertices are positioned, and which face or adjoin circumferential surfaces or corners of the second storage.
Substrate transfer device and power supply method for substrate transfer device
Provided is a substrate transfer device comprising: a tile part forming a moving surface of an area where a substrate is transferred and provided with a plurality of first coils that generate magnetic field on the moving surface by a power supplied from a power supply part; and a substrate transfer module including a plurality of magnets that exert a repulsive force against the magnetic field and a substrate holder configured to hold a substrate to be transferred, the substrate transfer module configured to move above the moving surface by magnetic levitation using the repulsive force, wherein the substrate transfer module includes a second coil for wirelessly supplying a power to a power consuming device provided in the substrate transfer module during movement above the moving surface using an electromotive force that is exerted against the magnetic field generated by the first coils.
SUBSTRATE PROCESSING SYSTEM
A substrate processing system including a substrate processing apparatus, a transport apparatus, and a controller. The substrate processing apparatus includes a substrate processing chamber, a substrate support, and an edge ring having a first horizontal surface and a first inclined surface. The transport apparatus includes a transport chamber, a transport arm, an optical sensor, a lens structure, and an actuator that moves the lens structure in a horizontal direction between a first horizontal position and a second horizontal position. The controller determines a consumption amount of the first horizontal surface based on an output of the optical sensor when the lens structure is at the first horizontal position, and determines a consumption amount of the first inclined surface based on an output of the optical sensor when the lens structure is at the second horizontal position.
Substrate for carrying wafer
The present disclosure is to provide a wafer carrier substrate for carrying a wafer on which a plurality of chips is formed, elements to be measured being built in the plurality of chips. The wafer carrier substrate includes: a vacuuming hole for vacuuming of the wafer placed on the wafer carrier substrate; a wafer alignment guide for determining a predetermined position of the wafer placed on the wafer carrier substrate; and a mark for determining a probe contact position. It is possible to recognize a specific shot, without any additional processing of the semiconductor wafer.
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
According to the technique of the present disclosure, there is provided a substrate processing apparatus capable of improving thickness uniformity of a film formed on each substrate. The apparatus includes a substrate retainer; a reaction tube; a vertical driver for moving the substrate retainer into or out of the reaction tube; a heater provided around the reaction tube; a gas supplier having a plurality of gas feeders corresponding to a plurality of substrates, respectively, supported by the substrate retainer; an exhauster through which a gas is exhausted from the reaction tube; and a controller capable of controlling the vertical driver and the gas supplier such that the gas is capable of being supplied through the plurality of gas feeders while maintaining a relative position of a substrate with respect to a gas feeder corresponding thereto at a first position or at a second position different from the first position.
Storage buffer for automated material handling system
Storage systems and method of using the same are provided. An exemplary storage system according to the present disclosure includes a storage device including a plurality of storage locations arranged in an upright stadium shape and a plurality of load ports each movable to engage any of the plurality of storage locations.
Substrate transfer method, substrate processing apparatus, and recording medium
A substrate transfer method performed in a substrate processing apparatus including a transfer mechanism group configured to transfer a substrate into a carrier via a module group and an exposure apparatus is provided. The transfer mechanism group includes a first transfer mechanism configured to transfer the substrate in an order of the pre-stage module, the exposure apparatus, and a first post-stage module, and a second transfer mechanism configured to transfer the substrate in an order of the first post-stage module, a heating module, a developing module, and a second post-stage module, a post-stage transfer mechanism. The substrate transfer method includes comparing an exposure apparatus cycle time with a section transfer time required to transfer the substrate from a transfer section by the second transfer mechanism to a transfer section by the post-stage transfer mechanism; and setting the section transfer time based on a result of the comparing.
Transport device with muting device
A transport device includes a transport vehicle, a cover member, an invasion detection sensor, and a muting device configured to invalidate the invasion detection sensor. The transport vehicle includes a mounting section and a wagon section configured to support the mounting section and travel. The detection surface is disposed to intersect with the movement trajectory of the transport target. The muting device invalidates the invasion detection sensor in response to an affirmative detection result from a mount sensor and an affirmative detection result from a range detection sensor, and the muting device validates the invasion detection sensor in response to a negative detection result from the mount sensor or a negative detection result from the range detection sensor.
Transport vehicle
A first container includes a pair of first held sections serving as a pair of held sections, and a second container includes a pair of second held sections serving as a pair of held sections. A first distance between the two first held sections is smaller than a second distance between the two second held sections. A first detector is configured to detect a detection target section in the first held sections and not detect the detection target section in the second held sections while a holder device is disposed at a holding reference position. A second detector is configured to detect a detection target section in the second held sections and not detect the detection target section in the first held sections while the holder device is disposed at the holding reference position.