In a substrate processing apparatus, an orientation converting area is provided between a transfer block and a batch processing area; a single-wafer transporting area is positioned adjacently to the transfer block and the orientation converting area; and the single-wafer processing area is positioned adjacently to the single-wafer transporting area. A center robot in the single-wafer transporting area transports the substrate from the second orientation converting mechanism in the orientation converting area, to the single-wafer processing chambers in the single-wafer processing area, and to the buffering unit. The center robot includes a horizontally movable hand that holds a substrate in a horizontal orientation, and a lifting stage that raises and lowers the hand, and the lifting stage has a fixed position in the horizontal direction.

A transport vehicle that transports a container while being suspended includes a lateral swing suppression device configured to abut against an outer side surface of the container that is suspended and held, and suppress a lateral swing of the container. The lateral swing suppression device includes an abutment roller configured to rotatably abut against the outer side surface of the container. A concave groove extending continuously over an entire periphery of an outer peripheral surface of the abutment roller is formed in a region corresponding to a convex portion of the container.

Discussed is a self-assembly apparatus that can include a chamber, at least one first supply part configured to supply a fluid to the chamber, a mounting part disposed on a first side of the chamber to mount a substrate to be inclined with respect to a horizontal plane of the chamber, the substrate having an assembly surface, and a magnet module disposed on an opposite surface of the substrate opposite to the assembly surface of the substrate, wherein the mounting part is configured to: insert the substrate into an upper side of the chamber, guide the inserted substrate from the upper side of the chamber toward a lower side of the chamber, and fix the guided substrate to the lower side of the chamber.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a treating bath having an accommodation space for accommodating a treating liquid; a support member configured to support at least one substrate in a vertical posture at the accommodation space; and a posture changing robot configured to change a posture of a substrate immersed in the treating liquid from the vertical posture to a horizontal posture, and wherein the posture changing robot comprises: a body configured to hold the substrate thereon; and a liquid supply member configured to supply a wetting liquid to the substrate placed on the body.

System and method for cross-fab wafer transportation are provided. A method includes providing a first FAB building and a second FAB building connected via a bridging area, the second FAB building comprising fabrication tools configured to perform fabrication processes different than fabrication processes performed by fabrication tools in the first FAB building, after performing fabrication processes in the first FAB building, configuring a first vehicle of the first FAB building to travel along a first OHT track and take the wafer to the bridging area, configuring a second vehicle of the second FAB building to travel along a second OHT track and arrive at the bridging area, where a portion of the first OHT track is in parallel with a portion of the second OHT track at the bridging area, when some predetermined conditions are met, configuring the first vehicle to transfer the wafer to the second vehicle.

Provided are a transfer unit and a substrate treatment apparatus which can stably vacuum-adsorb a substrate and can be used for a long time. The transfer unit includes: a robot arm; and an end effector connected to the robot arm, wherein the end effector includes: a body; a vacuum hole formed in the body; and a pad installed on the body to surround the vacuum hole and including a first pad layer and a second pad layer stacked sequentially, wherein the first pad layer has greater elasticity than the second pad layer, and the second pad layer has greater hardness than the first pad layer.

There is provided a substrate processing apparatus in which throughput is improved by increasing the number of disposed single wafer type chambers while suppressing the size of the apparatus. According to the present invention, the single wafer type chambers can be stacked in a vertical direction, it is possible to provide a substrate processing apparatus in which more single wafer type chambers are mounted even in the same floor area as that of a conventional apparatus. Further, when a mechanism for carrying a substrate W into a single wafer type chamber (drying chamber) and a mechanism for carrying the substrate W out of the drying chamber are provided independently, the substrate can be smoothly transferred around the drying chamber. According to the present invention, it is possible to provide a substrate processing apparatus 1 having a small size and a high throughput.

A path setting system is used for setting paths of a plurality of transfer bodies in a substrate transfer device, the substrate transfer device including a substrate transfer area and the plurality of transfer bodies, each having a support configured to support a substrate and configured to float and move by a magnetic force from a floor forming the substrate transfer area. The path setting system includes a virtual area setting part configured to set a virtual area corresponding to the substrate transfer area, a path generating part configured to generate, in the virtual area, moving paths of the transfer bodies from a movement start position to a movement end position, and an interference determining part configured to determine interference between the moving paths.

Disclosed is a substrate treating apparatus provided with a treating block. The treating block includes a wet transportation region adjoining a batch treatment region and a single-wafer transportation region. The wet transportation region contains a second posture turning mechanism provided on an extension line of a line of six batch process tanks and configured to turn a posture of substrates, on which immersion treatment is performed, from vertical to horizontal, a belt conveyor mechanism configured to receive the substrates in a horizontal posture one by one from the second posture turning mechanism and transport the substrates to the single-wafer transportation region, and a liquid supplying unit configured to supply a liquid to wet the substrates, transported by the belt conveyor mechanism, with the liquid.

The present invention relates to a method of manufacturing a display device, and more particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for transporting semiconductor light emitting devices in a fluid contained in an assembly chamber. Specifically, the present invention includes a tray for accommodating a plurality of semiconductor light emitting devices, a chip supply unit configured to supply a plurality of semiconductor light emitting devices to the tray unit and a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit. And the nozzle unit includes holes formed at predetermined intervals on the tray unit to supply the semiconductor light emitting devices at predetermined intervals.