Described herein is a technique capable of improving the controllability of a thickness of a film formed on a large surface area substrate having a surface area greater than a surface area of a bare substrate and improving the thickness uniformity between films formed on a plurality of large surface area substrates accommodated in a substrate loading region by reducing the influence of the surface area of the large surface area substrate and the number of the large surface area substrates due to a loading effect even when the plurality of large surface area substrates are batch-processed using a batch type processing furnace.

The present disclosure relates to a tape-guided pin insertion feeding mechanism. The mechanism includes: a pin tape material tray configured to store a pin tape; a feeding mechanism configured to drive the pin tape to move horizontally towards a cutting mechanism to feed material; and a pickup mechanism rotatably disposed on one side of the cutting mechanism. The cutting mechanism is configured to cut a single insertion pin from the pin tape.

A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.

The present application discloses a processing furnace comprising a furnace chamber; at least one infrared temperature measurement device; at least one calibration device comprising a black body module connected to the detection field of view of the corresponding infrared temperature measurement device; a controller; wherein the infrared temperature measurement device is configured to be capable of detecting the temperature of the black body module in the corresponding calibration device and obtaining calibration temperature data, and the controller is configured to calibrate the infrared temperature measurement device according to the standard temperature data and the calibration temperature data.

A degassing chamber for degassing a material located on a workpiece, comprises a vacuum source and a vacuum reservoir in fluid communication with the vacuum source, a secondary chamber, a port valve which is movable between an open position to allow passage of a workpiece therethrough between the exterior of the degassing chamber and the secondary chamber and a closed position in which the port valve is fluidly sealed, and a reservoir valve which is movable between an open position to provide fluid communication between the secondary chamber and the vacuum reservoir and a closed position in which the reservoir valve is fluidly sealed. The degassing chamber may be provided subsequent to a printing machine in a production line, and has particular application for degassing silicone material when producing fuel cells.