A system includes a pattern recognition unit, a pick and place unit and a control unit. The pattern recognition unit determines an actual position of a connection area arranged on or above a substrate of a semiconductor module, the substrate being arranged on a base plate. The pattern recognition unit also determines an actual position of a first end of a terminal element attached to a housing arranged on the base plate, such that the substrate is arranged within a volume defined by the housing. The control unit determines a deviation between the actual position of the first end of the terminal element with respect to the actual position of the connection area. The pick and place unit moves to the actual position of the first end, picks up the first end of the terminal element, and subsequently moves the first end to the actual position of the connection area.

A chip packaging apparatus includes a first differential pin pair, a first pin, and a second pin. The first differential pin pair includes a first differential signal pin and a second differential signal pin. In addition, the first pin and the second pin are both located between the first differential signal pin and the second differential signal pin, and the first pin and the second pin are differential signal pins (or both are power pins). The first pin is adjacent to the first differential signal pin and the second differential signal pin. The second pin is adjacent to the first differential signal pin and the second differential signal pin. The first pin and the second pin are respectively located on two sides of a first imaginary straight line connecting the first differential signal pin to the second differential signal pin.

A semiconductor manufacturing apparatus includes a first chuck that has a first surface and a second surface opposite each other and receives a first substrate on the first surface, a second chuck that has a third surface and a fourth surface opposite each other and receives a second substrate on the third surface, a first imaging device connected to one side of the first chuck, and a second imaging device connected to one side of the second chuck. Each of the first imaging device and the second imaging device includes a light blocking part, and the light blocking part blocks a first portion of reflected light reflected from a first alignment key on the first substrate or a second alignment key on the second substrate.

A bonding apparatus for bonding a second substrate to a first substrate includes a support unit and a bonding unit. The support unit is configured to support the first substrate. The bonding unit is above the support unit and is configured to attach the second substrate. The bonding unit includes a tip member facing the support unit and a head member on the tip member. The tip member includes: a first part having a first region and a second region surrounding the first region, wherein the bonding apparatus is configured to eject a gas from the first region and the bonding apparatus is configured to form a vacuum in the second region; and a second part extending from the first part toward the head member. An area of a transverse section of the first part is less than an area of a transverse section of the second part.

Various embodiments of the present disclosure are directed towards a processing tool. The processing tool includes a housing structure defining a chamber. A first plate is disposed in the chamber. A first plasma exclusion zone (PEZ) ring is disposed on the first plate. A second plate is disposed in the chamber and underlies the first plate. A second PEZ ring is disposed on the second plate. The second PEZ ring comprises a PEZ ring notch that extends inwardly from a circumferential edge of the second PEZ ring.

Provided is a bonding device including a lower electrostatic chuck, an upper electrostatic chuck disposed above the lower electrostatic chuck, an elastic part disposed above the upper electrostatic chuck, a first shaft disposed on the upper electrostatic chuck and disposed in a space which is defined inside the elastic part, a first plate disposed on the first shaft and the elastic part, a bracket disposed on the first plate, a first cylinder disposed on the bracket, a guide rod disposed on the first plate, and a second cylinder disposed adjacent to the guide rod in a horizontal direction and connected to an upper end portion of the guide rod.