The present disclosure provides a miniature electrostatic chuck (ESC) for die-to-wafer (D2W) bonding. The ESC can be manufactured using conventional semiconductor processes, incorporating through-silicon-via (TSV) and through-dielectric-via (TDV) structures. The ESC with different sizes can be attached to and detached from a multi-axis robotic arm, allowing optimized D2W bonding processes.

This disclosure is directed to a surface mount device for colorful chips. The surface mount device has a base, a first transferring mechanism, a second transferring mechanism, a frame, a color identification module and a punching mechanism. The base carries the circuit board, the first transferring mechanism is arranged on the base, and the second transferring mechanism is arranged on the first transferring mechanism. The frame carries the transparent film. The frame is arranged on the first transferring mechanism and above the base. The frame has a window, and a side of the transparent film carrying the colored crystal grains faces to the circuit board. The color identification module is aligned to an area defined in the window. The color identification module is suspended on the frame. The punching mechanism is arranged on the second transferring mechanism and suspended over the window.

In a mounting apparatus, a head part supports: a first imaging unit and a second imaging unit each including an optical system and an imaging element disposed to satisfy a Scheimpflug condition such that a plane parallel to a reference plane becomes a focal plane; and a mounting tool performing a mounting work. The mounting apparatus includes a detection part detecting an inclination of a stage surface or a work plane with respect to the reference plane using height information of each of multiple spots calculated based on a first top-view image and a second top-view image obtained by displacing the head part with respect to a stage and causing the first imaging unit and the second imaging unit to respectively capture and output images of the multiple spots of the stage surface or the work plane serving as a target of the mounting processing.

Various embodiments of the present technology provide for the ultra-high density heterogenous integration, enabled by nano-precise pick-and-place assembly. For example, some embodiments provide for the integration of modular assembly techniques with the use of prefabricated blocks (PFBs). These PFBs can be created on one or more sources wafers. Then using pick-and-place technologies, the PFBs can be selectively arranged on a destination wafer thereby allowing Nanoscale-aligned 3D Stacked Integrated Circuit (N3-SI) and the Microscale Modular Assembled ASIC (M2A2) to be efficiently created. Some embodiments include systems and techniques for the construction of construct semiconductor devices which are arbitrarily larger than the standard photolithography field size of 2633 mm, using pick-and-place assembly.