A device which enables protection against an abruptly rising pulse such as an electromagnetic pulse in a compact size at a device level and a semiconductor package in which the device is mounted are provided. The semiconductor package (1, 2, 3) includes a substrate (12, 60, 70), an IC chip (21) arranged on the substrate (12, 60, 70), a plurality of connection parts (30) configured to connect the IC chip (21) to the outside, a plurality of bonding wires (40) configured to connect the IC chip (21) and corresponding ones of the plurality of connection parts (30), and a mechanism configured to bypass surge current applied to any of the plurality of connection parts (30) from the connection parts (30) to a ground potential via a path different from the plurality of bonding wires (40).