The present disclosure provides a method for manufacturing a semiconductor package. The method includes disposing a first semiconductor substrate on a temporary carrier and dicing the first semiconductor substrate to form a plurality of dies. Each of the plurality of dies has an active surface and a backside surface opposite to the active surface. The backside surface is in contact with the temporary carrier and the active surface faces downward. The method also includes transferring one of the plurality of dies from the temporary carrier to a temporary holder. The temporary holder only contacts a periphery portion of the active surface of the one of the plurality of dies.

An apparatus for producing a semiconductor device comprises a stage, a bonding head, a bonding tool and a first camera that are attached to the bonding head, and a controller, the apparatus moreover being such that the controller is configured to execute for each of one or more points: a process of mounting an inspection chip on a mounting surface; a process of acquiring, as an inspection image, an image of the mounting surface after the inspection chip has been mounted thereon captured by the first camera; a process of calculating, as an area correction amount C, a correction amount for a camera offset amount Ocm on the basis of the position of the inspection chip in the inspection image; and a process of associating the calculated area correction amount C and the position of a discretionary point and then storing the associated information in a storage device.

A bonding stage for positioning a bond head at a target position has a stage body on which the bond head is mounted and a linear carriage which is physically decoupled from the stage body. The stage body is drivable to move together with the linear carriage by way of electromagnetic interaction between the linear carriage and the stage body when the bond head is being moved towards the target position by the linear carriage. The stage body is also drivable to move relative to the linear carriage to position the bond head at the target position by way of the electromagnetic interaction.