A glass-plate working apparatus 1 includes: a scribe line forming device 5, glass-plate bend-breaking devices 15A and 15B, glass-plate peripheral edge grinding devices 19A and 19B, and a glass-plate transporting device 20 for carrying in and carrying out two glass plates 2 at a time with respect to each of the scribe line forming device 5, the glass-plate bend-breaking devices 15A and 15B, and the glass-plate peripheral edge grinding devices 19A and 19B, and X-Y coordinate system controlled movement of the glass-plate peripheral edge grinding devices 19A and 19B in simultaneous grinding of peripheral edges of the glass plates 2 is adapted to be effected independently of each other.

Letting a particle diameter be Dx (m) when a cumulative particle volume cumulated from the small particle diameter side reaches x (%) of the total particle volume in a particle size distribution obtained regarding cerium oxide included in a polishing liquid using a laser diffraction/scattering method, D5 is 1 m or less, D100 is 3 m or more, D50 is 0.8 to 2.4 m, and DpeakD5 is less than D95Dpeak.