A power module is provided. The power module includes a substrate provided with a chip mounted thereon, a molded portion provided to surround the substrate and the chip, a lead portion having one end electrically connected to the chip inside the molded portion and the other end exposed to an outside of the molded portion, and an insulating rib portion protruding from an outer surface of the molded portion on which the lead portion is provided.

A described example apparatus includes: at least one semiconductor die mounted on a die pad of a package substrate having a first thickness, the package substrate having a device side layer of a second thickness less than the first thickness and having a board side layer of a third thickness less than the first thickness; electrical connections between bond pads and leads formed in the device side layer, the leads connected to corresponding terminals formed in the board side layer; and mold compound covering the device side layer, the electrical connections, and the at least one semiconductor die, the terminals having a board side surface exposed from the mold compound and having a tail portion having a first width, a central portion extending towards the die pad having a second width greater than the first width, and a tapered portion that connects the central portion to the tail portion.