A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

Implementations of a semiconductor package may include a metal containing substrate including a solder preform coupled thereto and a laminated substrate including an opening. The laminated substrate may be fixedly coupled to the metal containing substrate through the solder preform.

An example semiconductor package includes a package substrate including a plurality of bonding pads; a plurality of semiconductor chips mounted on an upper surface of the package substrate and including a plurality of pads, respectively, where each of the plurality of pads includes first to eighth data pads; and a plurality of wires connecting the plurality of pads, respectively, where the plurality of semiconductor chips include first to fourth semiconductor chips, the first to fourth data pads included in the first semiconductor chip and the first to fourth data pads included in the second semiconductor chip are connected to each other through first to fourth wires, respectively, and the first to fourth wires are separated from the third semiconductor chip and the fourth semiconductor chip.