A semiconductor workpiece transport pod includes: a lower container, having a top opening; an upper cover, having at least one lateral surrounding groove; and at least one airtight strip, having a base and at least one skirt, the base accommodated in the lateral surrounding groove, the skirt connected to the base and extending outward. When the upper cover is joined with the top opening of the lower container, the skirt of the airtight strip is elastically bent and presses tightly against an inner sidewall of the lower container to form airtightness.

The instant disclosure discloses a container system, comprising an inner base, configured to receive a workpiece, the inner base including a first treatment area that corresponds to a workpiece accommodating region, a second treatment area arranged around the first treatment area of the inner base, and a workpiece supporting post arranged at a border region between the first treatment area and the second treatment area.

Optimizing purge flow parameters in a substrate container, includes streaming a purge working fluid into an interior of the substrate container, discharging the purge working fluid from the interior of the substrate container, and varying purge flow parameters of the purge working fluid for a predetermined period of time, detecting at least one environmental condition in the interior of the substrate container during the predetermined period of time, determining optimized purge flow parameters based on the varied purge flow parameters and the at least one detected environmental condition during the predetermined period of time, and adjusting the streaming and the discharging in accordance with the optimized purge flow parameters. The substrate container may include, for example, a front opening unified pod or a reticle pod.

The present invention relates to a method of manufacturing a display device, and more particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for transporting semiconductor light emitting devices in a fluid contained in an assembly chamber. Specifically, the present invention includes a tray for accommodating a plurality of semiconductor light emitting devices, a chip supply unit configured to supply a plurality of semiconductor light emitting devices to the tray unit and a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit. And the nozzle unit includes holes formed at predetermined intervals on the tray unit to supply the semiconductor light emitting devices at predetermined intervals.

A wafer boat system comprises a carrier and a plurality of holder rings configured to support a wafer in the carrier. Each of the holder rings has an annular body and ring projections projecting from said annular body for contact with the wafer. At the ring projections, a local surface area of the annular body is small compared to a circumferential average or median of the local surface area of the annular body, in particular so as to at least partly compensate for a surface area of the respective ring projection, thereby promoting evenness of vapor deposition on wafers supported on the holder rings in the carrier. The reduced local surface area is preferably realized by a relatively large inner radius of the annular body at the ring projection. The carrier may provide a reference structure for automated wafer positioning.

A method for calibrating a tray shield used for holding a wafer for processing is provided. The tray shield is in a ring shape. The method includes determining whether a first calibration ring is placeable into an inner chamber of the tray shield. When the first calibration ring is placeable into the inner chamber, the tray shield is determined to be usable for wafer processing. The first calibration ring is moved around inside the inner chamber to remove metal particles or burrs on the inner chamber, and thereafter, a wafer is loaded in the inner chamber. When the first calibration ring is not placeable into the inner chamber, the tray shield may be discarded. The method may also include assembling the tray shield utilizing a second calibration ring having an outer diameter equal to an inner diameter of the ring shape.

A wafer transfer carrier includes a container and a lid portion. The container accommodates a wafer and a liquid, and is movable in a state where the wafer is in contact with the liquid. The lid portion is capable of sealing an inside of the container.

Provided is a substrate processing apparatus, including: transportation chamber maintained in an atmospheric environment where a substrate is transported; a vacuum processing chamber connected with the transportation chamber through a load lock chamber; a substrate placing table installed in the vacuum processing chamber and having a body part and a surface part that is attachable to/detachable from the body part; a storage unit installed in the load lock chamber or the transportation chamber and configured to receive the surface part; and a transportation mechanism configured to transport the substrate from the transportation chamber to the vacuum processing chamber through the load lock chamber and transport the surface part between the storage unit and the body part of the vacuum processing chamber.

A method of mass-transferring a plurality of micro semiconductor chips, including mass-transferring a plurality of first micro semiconductor chips onto a first substrate such that they are disposed in a plurality of first grooves of the first substrate; determining whether an empty first groove is present; and positioning a second micro semiconductor chip in the empty first groove, wherein the positioning may include transferring a plurality of second micro semiconductor chips onto a second substrate separate from the first substrate; and adsorbing the second micro semiconductor chip from the second substrate, and positioning the adsorbed second micro semiconductor chip in the empty first groove, using an electrostatic force or an electromagnetic force.

A cassette handle includes a body, a first foot, and a second foot. When in a position following the application of a force to the body, the first foot and the second foot can engage a cassette for semiconductor wafers or samples. When in another position following the removal of the applied force, or absent an application of a force to the body, the first foot and the second foot are disengaged from the cassette. Recesses and/or markers on the first foot and the second foot indicate when the first foot and the second foot are correctly engaged with the cassette. Where the cassette handle includes both recesses and markers, the markers may be inset within the recesses.