Implementations of a semiconductor package may include two or more die, each of the two more die coupled to a metal layer at a drain of each of the two more die, the two or more die and each metal layer arranged in two parallel planes; a first interconnect layer coupled at a source of each of the two more die; a second interconnect layer coupled to a gate of each of the two or more die and to a gate package contact through one or more vias; and an encapsulant that encapsulates the two or more die and at least a portion of the first interconnect layer, each metal layer, and the second interconnect layer.

Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.

A semiconductor device includes a semiconductor element, a first lead, and a sealing resin. The first lead includes a die pad portion including a first lead reverse surface, and a first terminal portion. The sealing resin includes a second resin surface facing in a z direction and a third resin surface facing in an x direction. The first lead includes a metal layer. The first lead reverse surface is exposed from the second resin surface. The first terminal portion includes a first-terminal base portion and a first-terminal tip portion. The first-terminal base portion passes through the third resin surface, and is spaced apart from a first resin surface in the z direction. The first-terminal tip portion is located below the first-terminal base portion. The first-terminal tip portion includes a tip surface exposed from the metal layer, and a recessed surface covered with the metal layer.