A system for holding and transporting one or more workpieces is disclosed. The system includes a cassette that is configured to support a carrier and a workpiece at two different elevations. In this way, as the carrier with the workpiece is placed on the cassette by a first robot, the carrier moves down further, as the workpiece is supported by taller support posts. The end effector of a second robot may then later remove only the workpiece from the cassette for processing. The processed workpiece is later placed back in the cassette by the second robot. This processed workpiece is then removed, along with the carrier, by the first robot. Carriers may be created to accommodate different sized workpieces such that the cassette remains unchanged.

A finFET device includes a doped source and/or drain extension that is disposed between a gate spacer of the finFET and a bulk semiconductor portion of the semiconductor substrate on which the n-doped or p-doped source or drain extension is disposed. The doped source or drain extension is formed by a selective epitaxial growth (SEG) process in a cavity formed proximate the gate spacer. After formation of the cavity, advanced processing controls (APC) (i.e., integrated metrology) is used to determine the distance of recess, without exposing the substrate to an oxidizing environment. The isotropic etch process, the metrology, and selective epitaxial growth may be performed in the same platform.

An apparatus including a drive, a first robot arm, a mechanical drive transmission, and a second robot arm. The first robot arm includes a first upper arm, a first forearm and a first end effector, where the first upper arm is connected to the drive at a first axis of rotation, and where the first end effector comprises two laterally spaced substrate holding areas. The mechanical drive transmission connects the drive to the first forearm at a first joint between the first upper arm and the first forearm for the drive to rotate the first forearm, where the mechanical drive transmission includes at least one non-circular pulley and a first band. The second robot arm includes a second upper arm, a second forearm and a second end effector, where the second upper arm is connected to the drive at the first axis of rotation.

A substrate transport apparatus including a frame, a substrate transport arm connected to the frame, the substrate transport arm having an end effector, and a drive section having at least one motor coupled to the substrate transport arm, wherein the at least one motor defines a kinematic portion of the drive section configured to effect kinematic motion of the substrate transport arm, and the drive section includes an accessory portion adjacent the kinematic portion, wherein the accessory portion has another motor, different and distinct from the at least one motor, the another motor of the accessory portion is operably coupled to and configured to drive one or more accessory device independent of the kinematic motion of the substrate transport arm.

A substrate transfer module, which provides clean environment to prevent particles from moving to a substrate, and semiconductor manufacturing equipment including the same. The substrate transfer module of the semiconductor manufacturing equipment includes a transfer chamber providing a transfer space of the substrate, having a chamber groove lowered by a predetermined height from a bottom surface to form a gap with respect to the bottom surface, a guide member provided in an inside portion of the transfer chamber, and a substrate transfer robot configured to move along the guide member and to transfer the substrate.

Provided is an apparatus for treating a substrate, which includes: a chamber having a treating space; a substrate support unit supporting and rotating a substrate in the treating space; a liquid supply unit supplying a chemical liquid to the substrate supported on the substrate support unit; a laser irradiation unit irradiating a laser to a bottom of the substrate supported on the substrate support unit; and a laser reflection unit coupled to the laser irradiation unit, and reflecting the laser irradiated and reflected to the bottom of the substrate, in which the laser reflection unit includes a reflection member reflecting the laser reflected from the substrate, and a driving member tilting the reflection member at a predetermined tilt angle.

A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.

A substrate processing system including a substrate processing apparatus, a transport apparatus, and a controller. The substrate processing apparatus includes a substrate processing chamber, a substrate support, and an edge ring having a first horizontal surface and a first inclined surface. The transport apparatus includes a transport chamber, a transport arm, an optical sensor, a lens structure, and an actuator that moves the lens structure in a horizontal direction between a first horizontal position and a second horizontal position. The controller determines a consumption amount of the first horizontal surface based on an output of the optical sensor when the lens structure is at the first horizontal position, and determines a consumption amount of the first inclined surface based on an output of the optical sensor when the lens structure is at the second horizontal position.

It is possible to increase a transfer throughput of the substrate. There is provided a technique that includes: (a) supporting a container capable of accommodating a substrate with a first container support; and (b) controlling a rotating shaft for revolving placement structures arranged in a circumferential direction, an elevating structure for elevating a transfer robot and the transfer robot such that, when transferring a container from the transfer robot to a predetermined placement structure, a second moving speed of the elevating structure at which the transfer robot is elevated is faster than a first moving speed at which the predetermined placement structure is moved to a transfer position where the container is transferable from the transfer robot.

An end effector is disclosed. Exemplary end effector includes a paddle, wherein a proximal end of the paddle is provided with a rear protrusion for positioning a substrate; a ring extending from the paddle, wherein the ring is provided with a circular protrusion for supporting the substrate; and a blade extending from the ring, wherein a distal end of the blade is provided with a front protrusion for positioning a substrate.