A processing method of processing multiple chips using an electrostatic carrier, which includes a main body having conductivity and provided with multiple through holes in a thickness direction thereof; and an insulating layer formed on a front surface of the main body, includes arranging and placing the multiple chips on a holding surface of the electrostatic carrier; supplying power to the main body to electrically charge the main body; and bringing an earth wire into contact with the chip to generate an electrostatic force between the chip and the main body.

The substrates supported in substrate holders are carried on holder carriers in a manner, that their extended surfaces are exposed to the surrounding atmosphere along an extended surface of the holder carriers. The holder carriers include an axis traverse to their extended surface. The substrates on a holder carrier are vacuum treated in a vacuum treatment chamber. This chamber communicates via a gate valve with a transfer vacuum chamber. A holder carrier with substrates in the vacuum treatment chamber is exchanged with a holder carrier carrying untreated substrates from the transfer vacuum chamber 23 by means of an exchange robot. During treatment in the vacuum treatment chamber, holder carriers with treated substrates and holder carriers with untreated substrates are exchanged in the transfer vacuum chamber through a gate valve. The transfer vacuum chamber acts as a load-lock.

Disclosed are an interface module capable of increasing substrate throughput, a method of operating the interface module, and a substrate processing apparatus including the interface module. The interface module configured to load and unload a substrate in the substrate processing apparatus includes a load port module including a plurality of load ports configured to allow a container accommodating a substrate to be placed thereon and an index module disposed on one side of the load port module and configured to unload the substrate from the container and load the substrate into a buffer module or to load a substrate processed in the substrate processing apparatus into the container.

A substrate transport method is employed in a substrate processing system including a plurality of processing chambers, a load lock chamber, a vacuum transport device provided in a vacuum transport chamber connecting the load lock chamber and the plurality of processing chambers and configured to simultaneously transport a plurality of substrates, and an atmospheric transport device provided in an atmospheric transport chamber and configured to transport a substrate from a carrier to the load lock chamber. The substrate transport method includes acquiring in advance a relative positional error for a case where the plurality of substrates are transported from the load lock chamber to the plurality of processing chambers and placed on a stage in the plurality of processing chambers, and placing the plurality of substrates on a stage in the load lock chamber, based on a transport path of the plurality of substrates and the relative positional error.

Provided is a transfer robot for transferring a substrate, the transfer robot including: a hand for supporting a substrate; and a driving unit for driving the hand, in which the hand includes: a base plate; a first support part mounted on the base plate and vacuum-adsorbing a bottom surface of the substrate and supporting the substrate; and a second support part mounted on the base plate and supporting an edge region of the substrate, and the first support part and the second support part are configured to support the substrate at different heights.

The present disclosure discloses a transfer device, semiconductor process equipment, and a wafer transfer method, and involves the semiconductor field. A transfer device includes an adsorption finger, a heating element, a first temperature measurement element, a second temperature measurement element, and a control element. The adsorption finger includes an adsorption member configured to adsorb the wafer. The heating element and the first temperature measurement element are arranged at the adsorption member. The second temperature measurement element is arranged at the adsorption finger and spaced apart from the adsorption member. The control element is electrically connected to the heating element, the first temperature measurement element, and the second temperature measurement element. The control element is configured to, when a temperature measured by the second temperature measurement element is higher than a temperature measured by the first temperature measurement element, and according to a difference between the temperature measured by the second temperature measurement element and the temperature measured by the first temperature measurement element, control the heating element to heat the adsorption member to cause the temperature difference to be within the preset temperature difference range. The present disclosure can solve the issue of warping of the wafer due to the large temperature difference between the adsorption plate of the manipulator and the wafer.

In a wafer hand, two carry portions are arranged in line in a first direction, the two carry portions are connected via a joint portion, each of the two carry portions extends from the joint portion in a second direction orthogonal to the first direction, an interval between inner side surfaces of the two carry portions is 170 mm or more, an interval between outer side surfaces of the two carry portions is 280 mm or less, and when a distance between inner side surfaces of the two carry portions is A (mm), and a length of the inner side surfaces of the two carry portions in the second direction is L (mm), a relationship of L(300.sup.2A.sup.2).sup.0.5 is satisfied.

A chip transferring system including a stage, a protection cover and a pick-and-place component is provided. The stage has a supporting region and is configured to support a workpiece by the supporting region. The protection cover includes a cover body configured to be located above the supporting region to cover the supporting region, wherein the cover body has an opening. The pick-and-place component is configured to pass through the opening of the cover body to pick a chip from the workpiece on the supporting region or place the chip to the workpiece on the supporting region. In addition, a protection cover and a chip transferring method are also provided.