A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.

The present disclosure provides a method for manufacturing a semiconductor package. The method includes disposing a first semiconductor substrate on a temporary carrier and dicing the first semiconductor substrate to form a plurality of dies. Each of the plurality of dies has an active surface and a backside surface opposite to the active surface. The backside surface is in contact with the temporary carrier and the active surface faces downward. The method also includes transferring one of the plurality of dies from the temporary carrier to a temporary holder. The temporary holder only contacts a periphery portion of the active surface of the one of the plurality of dies.

A process flow for bonding a die to a substrate incorporates defectivity risk management and yield promotion by reducing flow complexity. In some embodiments, the process flow may include a radiation process on a component substrate to weaken an adhesive bonding of dies from a surface of the component substrate, a first wet clean process on the component substrate after the radiation process to clean die bonding surfaces, eject and pick processes after performing the first wet clean process to remove dies from the component substrate for bonding to a substrate, a plasma activation process on the substrate, a second wet clean process after the plasma activation process on the substrate to clean a substrate bonding surface of the substrate, and a hybrid bonding process to bond die bonding surfaces of the dies to the substrate bonding surface of the substrate.

A method and equipment for manufacturing a package structure are disclosed. The equipment includes a first space, a de-bonding apparatus, a second space and a fluid supply device. The de-bonding apparatus is disposed in the first space, and configured to perform a de-bonding process. The second space is disposed around the first space. The fluid supply device is configured to make a first humidity of an atmosphere in the first space greater than a second humidity of an atmosphere in the second space.

A bonding system includes a processing station that performs a required processing on a first substrate and a second substrate; and a carry-in/out station that carries the first substrate, the second substrate, and a combined substrate, which is formed by bonding the first substrate and the second substrate, to/from the processing station. The processing station includes a transfer device that transfers the first substrate, the second substrate, and the combined substrate; a delivery module that delivers the first substrate, the second substrate, and the combined substrate between the carry-in/out station and the transfer device; a coating apparatus that applies an adhesive to the first substrate; a bonding apparatus that bonds the first substrate and the second substrate; and a heat treating apparatus that heat-treats the first substrate, the second substrate, and the combined substrate. The heat treating apparatus and the bonding apparatus are arranged in a stacked manner.

A tape affixing apparatus and a tape magazine capable of automatically switching or replacing a dicing tape. An affixing apparatus 3 includes a base section 31 on which a tape magazine 4 accommodating a dicing tape DT wound in a roll shape with a part of the dicing tape DT reeled out is installed to be replaceably mountable, movable guide rollers 32a and 32b, fixed guide rollers 33a and 33b, and a knife plate 35 that are movable to regulate a reel-out region R where the part of the dicing tape DT is reeled out to a predetermined track.

A die bonding apparatus includes a push-up unit, a head having a collet that sucks a die, and a control device. The control device is configured to suck a dicing tape using a dome plate; land the collet onto the die using the head; suck the die using the collet; lift plural blocks from the dome plate; stop the outermost block disposed on the outermost side among the plural blocks from lifting at a height where the die is peeled off from the dicing tape; and lift blocks other than the outermost block among the plural blocks higher than the outermost block to a predefined height.

An adhesive tape application system includes an adhesive tape dispenser configured to dispense adhesive tape, a laminating unit configured to laminate the adhesive tape on a workpiece, and a photo-treatment device between the adhesive tape dispenser and the laminating unit and configured to perform photo-treatment of the adhesive tape to tune an adhesive strength of the adhesive tape.

A wafer transfer method for forming a second work unit by transferring a wafer of a first work unit including a first ring frame, a first adhesive tape, and the wafer to a second adhesive tape includes sandwiching a claw body between the first ring frame and a second ring frame, affixing the second adhesive tape to a surface of the wafer which surface is not affixed to the first adhesive tape, holding the wafer by the second ring frame via the second adhesive tape, and peeling off the first adhesive tape from the wafer.

A protective tape peeling apparatus may include a support table to support wafers having respective protective tapes attached thereto; a roller holder having an upper pinch roller and a lower pinch roller to move the protective tape peeled off from a wafer therebetween; an attachment portion to attach one end of the protective tape between the upper and lower pinch rollers to a first protective tape attached to a first wafer on the support table, and attach one end of the first protective tape between the upper pinch roller and the lower pinch roller to a second protective tape attached to a second wafer on the support table; and a reversing guide to reverse a non-adhesive surface of one end of the first protective tape between the upper and lower pinch rollers to face the support table when the roller holder moves from a first position to a second position.