A method for making forming a semiconductor package comprises forming a plurality of alignment marks in or on a carrier substrate; positioning and bonding a plurality of semiconductor dies to the carrier substrate based on the plurality of alignment marks; further processing the plurality of semiconductor dies into a reconstituted wafer; and decoupling the reconstituted wafer from the carrier substrate at an interface using a laser source. The alignment marks are interposed between the interface and the laser source.

A protective tape peeling apparatus may include a support table to support wafers having respective protective tapes attached thereto; a roller holder having an upper pinch roller and a lower pinch roller to move the protective tape peeled off from a wafer therebetween; an attachment portion to attach one end of the protective tape between the upper and lower pinch rollers to a first protective tape attached to a first wafer on the support table, and attach one end of the first protective tape between the upper pinch roller and the lower pinch roller to a second protective tape attached to a second wafer on the support table; and a reversing guide to reverse a non-adhesive surface of one end of the first protective tape between the upper and lower pinch rollers to face the support table when the roller holder moves from a first position to a second position.

A temporary stack for temporarily carrying an electronics structure for processing includes a reusable carrier structure and an electronics structure carried on the carrier structure. A bonding layer temporarily bonds the electronics structure to the carrier structure. The carrier structure includes a heat-generating layer configured to generate debonding heat for weakening the bonding layer. The bonding layer comprises at least one adhesive material. A method of debonding the temporary stack includes placing the stack in operative engagement with a source of debonding energy to generate debonding heat.

A temporary adhesive having excellent spin coating properties of a circuit side of a wafer and a support, and excellent heat resistance when the circuit side of the wafer or the support is attached to an adhesion layer or a rear surface of the wafer is processed, and is capable of easily separating the circuit side of the wafer from the support after polishing the rear surface of the wafer, and simply removing a adhesive attached to the wafer or the support after the separation. The adhesive contains a component (A) to be cured by a hydrosilylation reaction, and a component (B) containing an epoxy-modified polyorganosiloxane at a ratio in % by mass of the component (A) to the component (B) of 99.995:0.005 to 30:70. The component (B) is an epoxy-modified polyorganosiloxane having an epoxy value of 0.1 to 5.

A method includes forming a first tacking layer on a first connection partner, arranging a first layer on the first tacking layer, forming a second tacking layer on the first layer, arranging a second connection partner on the second tacking layer, heating the tacking layers and first layer, and pressing the first connection partner towards the second connection partner, with the first layer arranged between the connection partners, such that a permanent mechanical connection is formed between the connection partners. Either the tacking layers each include a second material evenly distributed within a first material, the second material being configured to act as or to release a reducing agent, or the tacking layers each include a mixture of at least a third material and a fourth material, the materials in the mixture chemically reacting with each other under the influence of heat such that a reducing agent is formed.