A method for making forming a semiconductor package comprises forming a plurality of alignment marks in or on a carrier substrate; positioning and bonding a plurality of semiconductor dies to the carrier substrate based on the plurality of alignment marks; further processing the plurality of semiconductor dies into a reconstituted wafer; and decoupling the reconstituted wafer from the carrier substrate at an interface using a laser source. The alignment marks are interposed between the interface and the laser source.

A temporary substrate, which is detachable at a detachment temperature higher than 1000 C. comprises: a semiconductor working layer extending along a main plane, a carrier substrate, an intermediate layer having a thickness less than 20 nm arranged between the working layer and the carrier substrate, a bonding interface located in or adjacent the intermediate layer, gaseous atomic species distributed according to a concentration profile along the axis normal to the main plane, the atoms remaining trapped in the intermediate layer and/or in an adjacent layer of the carrier substrate with a thickness less than or equal to 10 nm and/or in an adjacent sublayer of the working layer with a thickness less than or equal to 10 nm when the temporary substrate is subjected to a temperature lower than the detachment temperature.

A temporary stack for temporarily carrying an electronics structure for processing includes a reusable carrier structure and an electronics structure carried on the carrier structure. A bonding layer temporarily bonds the electronics structure to the carrier structure. The carrier structure includes a heat-generating layer configured to generate debonding heat for weakening the bonding layer. The bonding layer comprises at least one adhesive material. A method of debonding the temporary stack includes placing the stack in operative engagement with a source of debonding energy to generate debonding heat.

A method and a device for the separation of structures from a substrate. Furthermore, the invention relates to a method and a device for transferring structures from a first substrate to a second substrate.

Embodiments herein are generally directed to ejection assemblies for singulated dies and thinned wafers and methods related thereto. Die ejection assemblies may be used to minimize cracking or deformation of dies during post-singulation processing. Thus, the die ejection assemblies and methods described herein reduce the number of dies rejected after singulation and the number of failures during a die bonding process. In one general aspect, an apparatus for removing singulated dies from a dicing tape is provided. The apparatus may include a die ejector assembly, which may include a vacuum plate configured to engage with a portion of the dicing tape. A die ejector may be disposed in an ejector opening of the vacuum plate. One or more actuators may be configured to move at least a portion of the die ejector in a lateral direction relative to the upper surface of the vacuum plate.