A transport device includes a transport vehicle, a cover member, an invasion detection sensor, and a muting device configured to invalidate the invasion detection sensor. The transport vehicle includes a mounting section and a wagon section configured to support the mounting section and travel. The detection surface is disposed to intersect with the movement trajectory of the transport target. The muting device invalidates the invasion detection sensor in response to an affirmative detection result from a mount sensor and an affirmative detection result from a range detection sensor, and the muting device validates the invasion detection sensor in response to a negative detection result from the mount sensor or a negative detection result from the range detection sensor.

A load port detects an accommodation state of a plurality of substrates, which are accommodated in a FOUP while being arranged in a thickness direction. The load port includes an emitter, a camera, and a controller. The controller performs, by using information on an amount of change in a plurality of pixel values according to coordinates in the thickness direction, double determination as to whether two or more substrate are accommodated in an accommodation region in an imaging region, the accommodation region being a region for accommodating one of the plurality of substrates.

A system includes a factory interface, a load port, and a controller. The controller detects when a container is received at the load port, where the container stores one or more parts. The controller directs a detection system, via one or more robot arms, to move according to one or more mapping patterns to obtain a mapping of the container, indicating regions and positions of detected parts. This mapping is recorded in a storage medium. Based on the mapping, the controller identifies any misalignment or misorientation of detected parts within the container. If such an issue is detected, the controller transmits an error message to a system controller associated with the manufacturing system, specifying the misalignment or misorientation of the affected part.

A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

An apparatus transfers a substrate. The apparatus includes: one substrate holder adsorbing and holding the substrate via an adsorption port; a nozzle being provided on a surface of the one substrate holder and allowing gas to pass therethrough; an adsorption flow path being connected to the adsorption port and allowing gas to flow therethrough; and a nozzle flow path being connected to the nozzle and allowing the gas to flow therethrough. The adsorption flow path of at least one of the one substrate holder and another substrate holder and the nozzle flow path are connected to a common gas suction mechanism. A pressure sensor and flow rate sensor are provided for the nozzle flow path. The flow rate of the nozzle flow path is varied according to a distance between an interferer and the one substrate holder and the pressure of the nozzle flow path.

An embodiment relates to an automatic carrier slot scanning apparatus for glass substrate semiconductor packages for automation of a glass substrate semiconductor package factory, and more particularly, to an automatic carrier slot scanning apparatus for glass substrate semiconductor packages configured to automatically scan positions and the number of glass substrates for slots of a carrier, compare the scanned information with related information of a manufacturing execution system, and thereby achieve synchronization.