A processing system includes: a chamber in which a consumable member is installed; a storage module configured to store the consumable member; a position detection sensor configured to detect a position of the consumable member; a vacuum transfer module connected to the chamber and the storage module, the vacuum transfer module having a transfer robot configured to transfer the consumable member between the chamber and the storage module; and a controller. The controller performs processes of: (a) controlling transfer robot to transfer consumable member installed in the chamber to the storage module; (b) detecting position of the consumable member transferred to the storage module by the position detection sensor; and (c) controlling transfer robot to transfer a new consumable member different from the consumable member from the storage module to the chamber at a position adjusted based on the position of the consumable member detected in the process (b).

An EFEM includes a housing including a transfer chamber in which a processing target object is transferred, and a connection module provided between the transfer chamber and a front chamber, wherein the housing includes a rear member having a housing-side opening through which the processing target object is capable of passing, the connection module includes a first frame part arranged around the housing-side opening and pressed by a transfer chamber-side surface of the rear member, a second frame part provided in the front chamber and arranged around a front chamber-side opening, and connected to the first frame part, and a sealing part configured to seal the second frame part and the front chamber, and the sealing part includes a flexible portion capable of expanding and contracting at least in a predetermined direction, and an enclosure portion connected to the flexible portion and configured to enclose the front chamber-side opening.

A finFET device includes a doped source and/or drain extension that is disposed between a gate spacer of the finFET and a bulk semiconductor portion of the semiconductor substrate on which the n-doped or p-doped source or drain extension is disposed. The doped source or drain extension is formed by a selective epitaxial growth (SEG) process in a cavity formed proximate the gate spacer. After formation of the cavity, advanced processing controls (APC) (i.e., integrated metrology) is used to determine the distance of recess, without exposing the substrate to an oxidizing environment. The isotropic etch process, the metrology, and selective epitaxial growth may be performed in the same platform.

Methods and apparatus for bonding chiplets to substrates are provided herein. In some embodiments, a multi-chamber processing tool for processing substrates includes: an equipment front end module (EFEM) having one or more loadports for receiving one or more types of substrates; and a plurality of automation modules coupled to each other and having a first automation module coupled to the EFEM, wherein each of the plurality of automation modules include a transfer chamber and one or more process chambers coupled to the transfer chamber, wherein the transfer chamber includes a buffer, and wherein the transfer chamber includes a transfer robot configured to transfer the one or more types of substrates, wherein at least one of the plurality of automation modules include a bonder chamber and at least one of the plurality of automation modules include a wet clean chamber.

A substrate transfer module, which provides clean environment to prevent particles from moving to a substrate, and semiconductor manufacturing equipment including the same. The substrate transfer module of the semiconductor manufacturing equipment includes a transfer chamber providing a transfer space of the substrate, having a chamber groove lowered by a predetermined height from a bottom surface to form a gap with respect to the bottom surface, a guide member provided in an inside portion of the transfer chamber, and a substrate transfer robot configured to move along the guide member and to transfer the substrate.

Substrate processing systems and methods have expanded substrate processing capabilities. For such systems, substrate handling chamber bodies of different styles and for different areas of the substrate processing system may be formed using a standard substrate handling chamber precursor. Such substrate handling chamber precursors may include an exterior shape most of which can be used for two (or more) different styles of substrate handling chamber bodies. During milling, the standard precursors can be milled in different ways and by removing different amounts of material to form substrate handling chamber bodies having different numbers of facets, with different shapes, and for different locations in a substrate processing system.

A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.

Proposed are a transfer module that can exhaust air without scattering particles, and a transfer chamber and a substrate processing apparatus including the transfer module. The transfer module that transfers a substrate in the substrate processing apparatus includes a vertical gantry member configured to extend in a vertical direction, a horizontal gantry member coupled to the vertical gantry member to move in the vertical direction and configured to extend along a first horizontal direction perpendicular to the vertical direction, a horizontal driving member coupled to the horizontal gantry member and configured to move along the first horizontal direction, and a substrate transfer robot coupled to the horizontal driving member and driven in a second horizontal direction perpendicular to the first horizontal direction and a rotation direction.

A substrate transfer unit includes a temporary placement stage and a transfer hand. Each of the temporary placement stage and the transfer hand holds a substrate at different locations depending on the processing state of the substrate.

Apparatus and techniques are described herein for use in manufacturing electronic devices, such as can include organic light emitting diode (OLED) devices. Such apparatus and techniques can include using one or more modules having a controlled environment. For example, a substrate can be received from a printing system located in a first processing environment, and the substrate can be provided a second processing environment, such as to an enclosed thermal treatment module comprising a controlled second processing environment. The second processing environment can include a purified gas environment having a different composition than the first processing environment.