Disclosed are an interface module capable of increasing substrate throughput, a method of operating the interface module, and a substrate processing apparatus including the interface module. The interface module configured to load and unload a substrate in the substrate processing apparatus includes a load port module including a plurality of load ports configured to allow a container accommodating a substrate to be placed thereon and an index module disposed on one side of the load port module and configured to unload the substrate from the container and load the substrate into a buffer module or to load a substrate processed in the substrate processing apparatus into the container.

Lid moving systems and methods facilitate reliable and safe movement of lids for chambers. Such systems may include: (a) a base member; (b) side walls extending from the base member with each including a cam surface defined therein; (c) a lid mounting arm extending away from the base member; (d) a first pivotal connection system engaging the cam surfaces and pivotally engaging the lid mounting arm; (e) a traveler member including a recess or opening on a surface facing the base member; (f) a second pivotal connection system pivotally engaging the traveler member with the lid mounting arm; (g) a motor for moving the traveler member (causing movement of the lid mounting arm with respect to the side walls); and/or (h) a stopper mechanism extending into the recess or opening of the traveler member from a direction of the surface facing the base member when the lid is opened.

A working system for a semiconductor packaging process includes a machine equipment, a supply unit and a return device. The supply unit is correspondingly connected to the machine equipment and includes an input device and an output device. The return device is connected to the input device and the output device. As such, a magazine is transferred from the input device to the output device via the return device, thereby accelerating the operation speed of a production line.

A calibration object is transferred from a processing chamber to an aligner station by one or more robot arms. The calibration object has a first processing chamber orientation in the processing chamber and a second orientation at the aligner station. A first characteristic error value associated with a transfer path between the processing chamber and the aligner is determined based on the first processing chamber orientation and the second orientation of the calibration object at the aligner station. In response to detecting an object at the aligner station to be transferred to the processing chamber along the transfer path, the object is aligned by the aligner station to be placed in the processing chamber according to a target processing chamber orientation based on a target aligner orientation as adjusted by the first characteristic error value determined for the transfer path between the processing chamber and the aligner station.

Provided is an apparatus for processing a substrate, the apparatus including: a process module for processing a substrate; a buffer unit having a buffer blade on which the substrate is placed; and transfer unit for transferring the substrate between the process module and the buffer unit, in which the buffer unit includes a moving member for moving the buffer blade so that the buffer blade is moved to a standby position and a use position where the transfer unit is accessible.

The present invention relates to a buffer chamber and a substrate processing apparatus including the buffer chamber. In more detail, the present invention relates to a buffer chamber that can maintain the atmosphere of a buffer unit at low humidity, and a substrate processing apparatus including the buffer chamber. According to an embodiment, the substrate processing apparatus includes: a processing module processing substrates; and an index module transferring substrates to the processing module from a container accommodating substrates, and putting substrates processed at the processing module into the container, wherein the processing module comprises: a transfer chamber having a transfer unit transferring substrates to the processing module; and a buffer chamber that is disposed between the index module and the transfer chamber and in which substrates are temporarily placed, the buffer chamber comprises: a housing providing a standby space; a door opening and closing the housing; a buffer unit in which substrates are placed in the standby space; a gas supply unit supplying gas to the standby space; and an exhaust unit exhausting the standby space, and pressures in the transfer chamber and the index module are different from each other.

A substrate processing apparatus includes a unit block including multiple liquid film forming devices each configured to form a liquid film on a top surface of a substrate, and a drying device configured to replace the liquid film with a supercritical fluid to dry the substrate; and a transfer block provided between the multiple liquid film forming devices and the drying device. The transfer block includes a transfer device configured to transfer the substrate between the multiple liquid film forming devices and the drying device, and a length of a transfer path of the substrate is equal between each of the multiple liquid film forming devices and the drying device.

An exemplary embodiment of the present invention provides a substrate treating method and a substrate treating apparatus that are capable of preventing contamination of a subsequent substrate. According to the exemplary embodiment, when the pressure monitoring operation of the transfer chamber, the method may include acquiring a graph representing the pressure change in the transfer chamber over time, and determining whether there is a pressure abnormality inside the transfer chamber based on a shape of the graph.