Disclosed herewith are an alignment apparatus and an alignment method for a susceptor of a processing chamber. The alignment apparatus includes a rotational module and a fitting module. The rotational module includes a bearing unit, a tubular member, and an attachment bracket. The attachment bracket is coupled to an end of the tubular member that is coupled to the bearing unit. The fitting module is coupled to the rotational module and includes a transparent plate configured to be disposed at a location above a susceptor of the processing chamber. The transparent plate includes plurality of first openings disposed along a first circular path and couples to a sensor that is configured to be positioned at a plurality of predetermined positions arranged along a second circular path that is concentric with the first circular path.

Disclosed is a container that receives a substrate type sensor. The container includes a body having a reception space, one side of which is opened, a door that selectively opens and closes the reception space, a shelf part that supports the substrate type sensor in the reception space, and a charging module that charges the substrate type sensor supported by the shelf part, and the charging module includes a charging part that moves between a standby location and a charging location that charges the substrate type sensor supported by the shelf part.

The present disclosure relates to a tape-guided pin insertion feeding mechanism. The mechanism includes: a pin tape material tray configured to store a pin tape; a feeding mechanism configured to drive the pin tape to move horizontally towards a cutting mechanism to feed material; and a pickup mechanism rotatably disposed on one side of the cutting mechanism. The cutting mechanism is configured to cut a single insertion pin from the pin tape.

The treating arrangement (900) for an epitaxial reactor (1000) comprises: a reaction chamber (100) for treating substrates, a transfer chamber (200) adjacent to the reaction chamber (100), for transferring substrates placed over substrates support devices, a loading/unloading group (300) at least in part adjacent to the transfer chamber (200), arranged to contain a substrates support device with one or more substrates, a loading/unloading chamber (400) at least in part adjacent to the loading/unloading group (300), having a first storage zone (410) for treated and/or untreated substrates and a second storage zone (420) for substrates support devices without any substrate, at least one external robot (500) for transferring treated substrates, untreated substrates and substrates support devices without any substrate between said loading/unloading chamber (400) and said loading/unloading group (300), at least one internal robot (600) for transferring substrates support devices with one or more substrates between said loading/unloading group (300) and said reaction chamber (100) via said transfer chamber (200); wherein said external robot (500) comprises an articulated arm (510) arranged to handle both treated substrates and untreated substrates as well as substrates support devices.

The treating arrangement (900) for an epitaxial reactor (1000) comprises: a reaction chamber (100) for treating substrates, a transfer chamber (200) adjacent to the reaction chamber (100), for transferring substrates placed over substrates support devices, a loading/unloading group (300) at least in part adjacent to the transfer chamber (200), arranged to contain a substrates support device with one or more substrates, a storage chamber (400) at least in part adjacent to the load-lock chamber (300), having a first storage zone (410) for treated and/or untreated substrates and a second storage zone (420) for substrates support devices without any substrate, at least one external robot (500) for transferring treated substrates, untreated substrates and substrates support devices without any substrate between said storage chamber (400) and said loading/unloading group (300), at least one internal robot (600) for transferring substrates support devices with one or more substrates between said loading/unloading group (300) and said reaction chamber (100) via said transfer chamber (200).

One aspect of the present disclosure provides a method of manufacturing a display device, including: a process of aligning a first wafer on which a plurality of first LEDs, a plurality of alignment keys, and a reference member are disposed with a donor substrate; a process of transferring the plurality of first LEDs and the reference member on the first wafer to the donor substrate; and a process of aligning a second wafer on which a plurality of second LEDs is disposed with the donor substrate based on the reference member. Therefore, a relative position between the plurality of second LEDs of the second wafer and the plurality of first LEDs of the donor substrate may be precisely aligned based on the reference member that maintains a predetermined interval from the plurality of first LEDs.

An electronic device is provided. The electronic device includes a plurality of conductive elements, a first electronic unit and a protective layer. The first electronic unit is disposed between two adjacent first conductive elements of the plurality of conductive elements. A second conductive element of the plurality of conductive elements is disposed adjacent to one of the two adjacent first conductive elements of the plurality of conductive elements. The protective layer surrounds the plurality of conductive elements and the first electronic unit. Moreover, the one of the two adjacent first conductive elements has a first width, the second conductive element has a second width, and the second width is less than the first width.

A load port mounting position adjustment mechanism is capable of adjusting a mounting position of a load port on a wall surface of a transfer chamber, and includes: an X-axis adjustment part configured to adjust the position of the load port in a width direction of the wall surface; a Y-axis adjustment part configured to adjust the position of the load port in a thickness direction of the wall surface; and a Z-axis adjustment part configured to adjust the position of the load port in a height direction of the wall surface. A three-axis adjustment mechanism that integrates the X-axis, the Y-axis, and the Z-axis adjustment parts is mounted to the wall surface by using a mounting hole formed in either an upper section or a middle section of the wall surface. This improves the workability of mounting the load port to the wall surface with a high precision.

A die placement system provides a tip body and die placement head to ensure planarity of a die to substrate without the need for calibration prior to each pick and place operation. A self-aligning tip incorporated into a tip body aids in die placement/attachment. This tip provides for global correction of planarity errors that exist between a die and substrate, regardless of whether those errors stem from gantry (i.e. die-side misalignment) or machine deck tool (i.e. substrate-side misalignment) misalignment.

A bonding and indexing method is provided, having a first index head to move a substrate in an indexing direction from a first position to a second position; a second index head to move the substrate in an indexing direction from the second position to a third position; and the first and/or second index head has a bonding element to effect a bonding process between the substrate and an element disposed against the substrate so that bonding and movement in the indexing direction is implemented simultaneously by the first index head and/or bonding and movement in the indexing direction is implemented simultaneously by the second index head.