A semiconductor package and the method of forming the same are provided. The semiconductor package may include a package substrate and a first package component over the package substrate. The first package component may include a first semiconductor die and a heat dissipation substrate over the first semiconductor die. The heat dissipation substrate may comprise a base portion and a first coating portion on a first surface of the base portion. The first coating portion may be between the first semiconductor die and the base portion. The base portion may comprise a first material with a first thermal conductivity and the first coating portion may comprise a second material different from the first material. The second material may have a second thermal conductivity smaller than the first thermal conductivity.

Methods, devices, and systems for driving optical modulators. An example integrated circuit includes a driver including: a first circuit having a first switch coupled between a first input and a first output and a second circuit having a second switch coupled between a second input and a second output. Each of the first and second switches is configured to receive a control signal adjustable to control a corresponding signal path with a corresponding input electronic signal. The first and second circuits are configured to control a rising edge and a falling edge of an output electronic signal at an output of the driver that is based on a first output electronic signal at the first output and a second output electronic signal at the second output. The output of the driver is electrically coupled to the optical modulator to provide the output electronic signal to modulate an optical signal.

Methods, devices, and systems for driving optical modulators. An example integrated circuit includes a driver including a first circuit having a first switch coupled between a first input and a first output and a second circuit having a second switch coupled between a second input and a second output. Each of the first and second switches is configured to receive a control signal adjustable to control a corresponding signal path with a corresponding input electronic signal. The first and second circuits are configured to control a rising edge and a falling edge of an output electronic signal at an output of the driver that is based on a first output electronic signal at the first output and a second output electronic signal at the second output. The output of the driver is electrically coupled to the optical modulator to provide the output electronic signal to modulate an optical signal.

A chip includes an active device, a first backside silicon layer disposed below the active device, a first backside metal path electrically coupled to the active device and extending through the first backside silicon layer, and a first electrical barrier disposed between one or more sides of the first backside metal path and the first backside silicon layer.