An electronic component 1 includes an element body, a first terminal electrode disposed on a main surface of the element body, a shield conductor disposed at a position closer to the main surface of the element body, a ninth conductor configured to connect the first terminal electrode and the shield conductor, and a first inductor and a second inductor disposed in the element body. The shield conductor is disposed at a position closer to the main surface in a second direction than a first inductor conductor or a second inductor conductor is. The shield conductor is positioned at least between the first inductor conductor and the second inductor conductor, and has a portion that does not overlap the first inductor conductor or the second inductor conductor, as viewed from the second direction.

Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

A radio-frequency (RF) device includes a main device on a substrate, a first port extending along a first direction adjacent to a first side of the main device, a second port extending along the first direction adjacent to a second side of the main device, a first shield structure adjacent to a third side of the main device, a second shield structure adjacent to a fourth side of the main device, a first connecting structure extending along a second direction to connect the first port and the main device, and a second connecting structure extending along the second direction to connect the second port and the main device.

A first in-memory computation (IMC) circuit includes a first IMC processing tile coupled for data communication to a first interface circuit. A second IMC circuit includes a second IMC processing tile coupled for data communication to a second interface circuit. A shared resource bus connects the first and second interface circuits. The first and second interface circuits are controlled by mode control signals to operate in: a first communications mode where signal lines of the shared resource bus support data communications between the first and second IMC circuits; and a second communications mode where a first subset of signal lines of the shared resource bus support data communications between the first and second IMC circuits and a second, different, subset of signal lines of the shared resource bus are driven to a fixed voltage level to provide shielding for the data communications over the first subset of signal lines.

Methods, devices, and systems for driving optical modulators. An example integrated circuit includes a driver including: a first circuit having a first switch coupled between a first input and a first output and a second circuit having a second switch coupled between a second input and a second output. Each of the first and second switches is configured to receive a control signal adjustable to control a corresponding signal path with a corresponding input electronic signal. The first and second circuits are configured to control a rising edge and a falling edge of an output electronic signal at an output of the driver that is based on a first output electronic signal at the first output and a second output electronic signal at the second output. The output of the driver is electrically coupled to the optical modulator to provide the output electronic signal to modulate an optical signal.

Methods, devices, and systems for driving optical modulators. An example integrated circuit includes a driver including a first circuit having a first switch coupled between a first input and a first output and a second circuit having a second switch coupled between a second input and a second output. Each of the first and second switches is configured to receive a control signal adjustable to control a corresponding signal path with a corresponding input electronic signal. The first and second circuits are configured to control a rising edge and a falling edge of an output electronic signal at an output of the driver that is based on a first output electronic signal at the first output and a second output electronic signal at the second output. The output of the driver is electrically coupled to the optical modulator to provide the output electronic signal to modulate an optical signal.