Disclosed is a substrate treating apparatus provided with a treating block. The treating block includes a wet transportation region adjoining a batch treatment region and a single-wafer transportation region. The wet transportation region contains a second posture turning mechanism provided on an extension line of a line of six batch process tanks and configured to turn a posture of substrates, on which immersion treatment is performed, from vertical to horizontal, a belt conveyor mechanism configured to receive the substrates in a horizontal posture one by one from the second posture turning mechanism and transport the substrates to the single-wafer transportation region, and a liquid supplying unit configured to supply a liquid to wet the substrates, transported by the belt conveyor mechanism, with the liquid.

The present invention provides an apparatus for treating a substrate. The apparatus of processing a substrate includes: a treatment bath having an receiving space accommodating treatment liquid, and treating a plurality of substrates; and a supporting unit supporting the substrates in the treatment bath, wherein the supporting unit includes: a support having a first supporting rod supporting end portions of the substrates in a vertical state; and a fixing plate coupled to the support and fixing the support, a plurality of first slots in which edges of the substrates are inserted is formed at the first supporting rod, each of the plurality of first slots is defined by a first side, a second side facing the first side, and a bottom, a front and a rear of the first slot are open toward the receiving space, and the bottom of the first slot comprises contact protrusions protruding upward from a lower end of the first side of the first slot and supporting lower end portions of the substrates.