A semiconductor package structure includes a base having a first surface and a second surface opposite thereto, wherein the base comprises a wiring structure, a first electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, a second electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, wherein the first electronic component and the second electronic component are separated by a molding material, a first hole and a second hole formed on the second surface of the base, and a frame disposed over the first surface of the base, wherein the frame surrounds the first electronic component and the second electronic component.

A housing for a semiconductor module includes sidewalls extending horizontally around an internal volume of the housing and a groove formed in a bottom surface of the sidewalls and extending along a circumference of the housing. The bottom surface of the sidewalls is configured to be attached to a substrate or a base plate. The groove extends into the sidewalls of the housing in a vertical direction. The groove includes a first section having a constant width in a horizontal direction and beveled edges between the first section and the bottom surface of the sidewalls. The beveled edges define a second section arranged between the first section and the bottom surface of the sidewalls, and having a varying width in the horizontal direction. The width of the second section gradually increases from the first section towards the bottom surface of the sidewalls.

A semiconductor package includes a substrate with metal conductors, integrated circuit (IC) chips disposed on the substrate and electrically connected with the metal conductors of the substrate, thermoelectric cooler (TEC) chips thermally connected with the IC chips and having thermoelectric coolers configured to cool respective zones of the semiconductor package, temperature sensors arranged to measure temperatures of the respective zones of the semiconductor package, and control circuitry to operate the thermoelectric coolers to cool the respective zones based on the measured temperatures of the respective zones. The control may include determining whether a temperature-indicative signal satisfies a thermal management action criterion, and performing a thermal management action corresponding to the thermal management action criterion in response to a determination that the temperature-indicative signal satisfies the thermal management action criterion.

A semiconductor apparatus includes: a base plate; an insulating circuit board including a ceramic substrate, a circuit pattern formed on an upper surface of the ceramic substrate, a metal layer formed on a lower surface of the ceramic substrate and fixed on an upper surface of the base plate with a first joint material; a semiconductor device having a first surface fixed on the circuit pattern with a second joint material and a second surface which is an opposite surface of the first surface; a lead frame fixed on the second surface with a third joint material; and a case fixed to an outer edge portion of the base plate and enclosing the semiconductor device, wherein restoring force acts on the insulating circuit board in a direction of warpage that is convex upward, and restoring force acts on the base plate in a direction of warpage that is convex downward.

A semiconductor apparatus includes: a base plate; an insulating circuit board including a ceramic substrate, a circuit pattern formed on an upper surface of the ceramic substrate, a metal layer formed on a lower surface of the ceramic substrate and fixed on an upper surface of the base plate with a first joint material; a semiconductor device having a first surface fixed on the circuit pattern with a second joint material and a second surface which is an opposite surface of the first surface; a lead frame fixed on the second surface with a third joint material; and a case fixed to an outer edge portion of the base plate and enclosing the semiconductor device, wherein restoring force acts on the insulating circuit board in a direction of warpage that is convex upward, and restoring force acts on the base plate in a direction of warpage that is convex downward.

A semiconductor module includes: semiconductor elements; wiring boards on which these semiconductor elements are mounted; terminals that are electrically connected to these wiring boards; a case that houses the semiconductor elements and the wiring boards. The case includes case through-holes into which these terminals are inserted such that root portions of the terminals respectively protrude from the case through-holes outside the case. The semiconductor module further includes auxiliary blocks that sandwich the root portions with the case to fix the terminals to the case; and a sealing material that closes gaps between the terminals and the case through-holes together with the auxiliary blocks and adheres the auxiliary blocks to the case.