A metal clip disposed on chips to connect the chips to each other, includes a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips; and an outer side part formed at each of the bonding parts to extend upward from at least a portion of an outer side of respective ones of the bonding parts to form a step therefrom.

A metal clip disposed on chips to connect the chips to each other, includes a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips; and an outer side part formed at each of the bonding parts to extend upward from at least a portion of an outer side of respective ones of the bonding parts to form a step therefrom.

A semiconductor device includes: a leadframe having a die pad, first leads and second leads, the second leads being connected with a leadpost; a first lateral transistor die having a first pad, second pad and third pad; a first clip, configured to connect the first pad to the die pad, which is connected with the first leads; and a second clip, configured to connect the second pad to the leadpost of the second leads), the leadpost being disconnected from the die pad. The second clip includes a first section contacting the second pad of the first lateral transistor die, a second section contacting the leadpost of the second leads, and a middle section between the first and the second sections. The middle section has partly a smaller width than the second section.

A semiconductor package, a method of manufacturing thereof, and a lead frame are provided, the package includes the lead frame and a die pad and a bond clip. The lead frame exhibits a longitudinal and a transverse dimension perpendicular to the longitudinal dimension. The package includes a die having a first die side mounted to the die pad mounting portion and a second die side opposite to the first, and a bond clip exhibiting a first and second longitudinal dimension perpendicular to the first longitudinal dimension. The bond clip has a first clip mounted to the bond clip of the lead frame using solder and a second clip mounted to the second die side of the die, the bond clip of the lead frame has features to prevent displacement of the bond clip in both the longitudinal and transverse dimension, and to confine the solder on the bond clip.

A semiconductor device includes: a first semiconductor chip and a second semiconductor chip each including a first main electrode on a bottom surface side and a second main electrode on a top surface side; a conductive member provided to electrically connect the first main electrode of the first semiconductor chip to the second main electrode of the second semiconductor chip; a first external terminal electrically connected to the second main electrode of the first semiconductor chip and partly opposed to the conductive member, and a resin member provided to be at least partly arranged between the conductive member and the first external terminal.

In the first aspect of the present disclosure, there is provided a method of manufacturing a semiconductor device, including the steps of: providing a substrate; mounting a semiconductor die having a first die surface and a second die surface opposite to the first die surface, with the first die surface mounted to the substrate; mounting a spacer having a first spacer surface and a second spacer surface opposite to the first spacer surface, with the first spacer surface mounted on the second die surface; fusing bonding to the second spacer surface by using ultrasonic fusing.

Various aspects relate to mechanisms for coupling a three-dimensional semiconductor cube to a host substrate including a plurality of substrate communication points. The three-dimensional semiconductor cube includes a plurality of cube communication points corresponding to the plurality of substrate communication points and at least one mounting mechanism that couples the three-dimensional semiconductor cube to the host substrate.

A semiconductor device includes a resin housing, a substrate, a plurality of semiconductor elements, and a signal terminal. Each of the semiconductor elements has a first main electrode on a first surface, a second main electrode and a pad on a second surface opposite to the first surface. The first main electrodes are joined to a wiring of the substrate. The signal terminal is inserted in the housing, and electrically connected to the pads. The signal terminal includes a branch terminal. The branch terminal has a single first connection portion projecting from the housing to be connected to an external device, a plurality of second connection portions exposed from the housing and individually connected to the pads having a same function of the semiconductor elements, and a coupling portion disposed within the housing and electrically connecting the first connection portion and the second connection portions.

A semiconductor device includes at least one semiconductor element, a metal plate and a solder. The semiconductor element includes a semiconductor substrate having an element region, a main electrode disposed at a position overlapping with the element region on one surface of the semiconductor substrate, a signal line disposed at a position overlapping with the element region on the one surface and different from the position of the main electrode, and an insulating film covering the signal line. The metal plate has a joint portion to the main electrode. The solder is interposed between the main electrode and the joint portion and joins the main electrode and the metal plate. The joint portion is disposed to avoid the signal line.

Provided is a semiconductor device with a configuration capable of ensuring insulation properties between terminals having different potentials and arranged with an insulating layer interposed. The semiconductor device includes: a first terminal; a second terminal having a part opposed to the first terminal and another part provided with a first opening not opposed to the first terminal; and an insulating layer including a body part interposed between the first terminal and the second terminal opposed to each other and a first protrusion connected to the body part and inserted to the first opening.