A package includes a semiconductor die disposed on a lead frame. A source contact pad is disposed on the semiconductor die. The package further includes a lead post shared by a plurality of leads that form external terminals of the package. The lead post has a clip-locking feature. A clip connects the source contact pad to the lead post. The clip has a key structure coupled to the clip-locking feature in the lead post.

A electrical connection element includes a planar mating surface adapted for mating with a metal bonding surface, a rim that forms an enclosed shape around the planar mating surface, and a plurality of outgassing grooves formed in the planar mating surface, wherein each of the outgassing grooves comprises a proximal end that is spaced apart from the rim and a distal end that intersects the rim, and wherein a cross-sectional area of each of the outgassing grooves increases along a lengthwise direction going from the proximal end to the distal end.

A metal clip disposed on chips to connect the chips to each other, includes a plurality of bonding parts each having a lower surface configured to bond to an upper surface of each of the chips; and an outer side part formed at each of the bonding parts to extend upward from at least a portion of an outer side of respective ones of the bonding parts to form a step therefrom.

A semiconductor package, a method of manufacturing thereof, and a lead frame are provided, the package includes the lead frame and a die pad and a bond clip. The lead frame exhibits a longitudinal and a transverse dimension perpendicular to the longitudinal dimension. The package includes a die having a first die side mounted to the die pad mounting portion and a second die side opposite to the first, and a bond clip exhibiting a first and second longitudinal dimension perpendicular to the first longitudinal dimension. The bond clip has a first clip mounted to the bond clip of the lead frame using solder and a second clip mounted to the second die side of the die, the bond clip of the lead frame has features to prevent displacement of the bond clip in both the longitudinal and transverse dimension, and to confine the solder on the bond clip.

Various aspects relate to mechanisms for coupling a three-dimensional semiconductor cube to a host substrate including a plurality of substrate communication points. The three-dimensional semiconductor cube includes a plurality of cube communication points corresponding to the plurality of substrate communication points and at least one mounting mechanism that couples the three-dimensional semiconductor cube to the host substrate.

A semiconductor device includes at least one semiconductor element, a metal plate and a solder. The semiconductor element includes a semiconductor substrate having an element region, a main electrode disposed at a position overlapping with the element region on one surface of the semiconductor substrate, a signal line disposed at a position overlapping with the element region on the one surface and different from the position of the main electrode, and an insulating film covering the signal line. The metal plate has a joint portion to the main electrode. The solder is interposed between the main electrode and the joint portion and joins the main electrode and the metal plate. The joint portion is disposed to avoid the signal line.